Methods to Avoid Electrochemical Migration Between Plate Wells

Abstract

The invention discloses a drill bit with a single chip removal groove and double cutting edges. The drill bit comprises a drillstock (1) and a drill lip (2); the drillstock (1) and the drill lip (2) are connected through a connecting part (3); the free end of the drill lip (2) is a drill tip (4); a double-helix cutting edge groove (5) is formed in the part, close to the drill tip (4), of the drill lip (2); and the single-helix chip removal groove (6) is formed in the part, close to the connecting part (3), of the drill lip (2). The invention further discloses a method for avoiding electrochemical migration between board holes. The method comprises the steps of S01, analyzing CAM data; S02, defining and screening high-risk hole pairs; and S03, designing a drilling path. According to the drill bit with the single chip removal groove and the double cutting edges and the method for avoiding the electrochemical migration between the board holes, the generation of cracks between the holes can be reduced to the maximum extent, and therefore the aim of preventing electrochemical migration failure can be achieved.

Description

technical field [0001] The invention relates to a drill bit with single flute and double cutting edges and a method for avoiding electrochemical migration between circuit board holes, belonging to the technical field of printed circuit boards. Background technique [0002] At present, with the development of electronic products in the direction of thinner and smaller, the wiring density and via hole density are also getting higher and higher. As the via hole density increases, the hole spacing becomes smaller and the risk of electrochemical migration between holes increases. [0003] The base material of modern ordinary rigid printed circuit boards is generally a glass fiber-based epoxy resin sheet, and the mixed resin (organic substance) mainly composed of epoxy resin is attached to the glass fiber woven cloth (inorganic substance) through a chelating agent (silane). This bond established by the chelating agent is unstable and easily broken. Drilling of circuit boards is ...

AI Technical Summary

Problems solved by technology

During the use of the circuit board, the residual electroplating solution will gradually dissolve copper into copper ions; if there is a potential difference between two adjacent via holes, the copper ions will be driven by the electric field along the resin The gap between the glass fiber and the glass fiber migrates from the anode to the cathode; during this process, the copper ions continue to get electrons and re-deposit as metallic copper; this process continues, and copper filaments starting from the anode will be produced ; When this filament reaches the cathode, it will short-circuit the two vias, causing the original electrical performance of the circuit board to fail

[0004] Since the above-mentioned electrochemical migration failure is a recessive defect, which generally occurs during the use of electronic products, and the defect is generally small and difficult to be discovered in time, so the current circuit board industry attaches great importance to this kind of electrochemical migration failure. Insufficient, lack of effective improvement methods in the industry

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