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Liquid cooling heat dissipation apparatus and motor controller

A liquid-cooled heat dissipation and cooling liquid technology, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problem of slow heat conduction of side-mounted cooling structures, achieve the goals of reducing thermal conduction resistance, solving thermal coupling, and improving heat conduction efficiency Effect

Active Publication Date: 2017-08-29
SUZHOU INOSA UNITED POWER SYST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a new liquid-cooled heat dissipation device and motor controller for the problem of slow heat conduction of the side-mounted cooling structure of the above-mentioned power module

Method used

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  • Liquid cooling heat dissipation apparatus and motor controller
  • Liquid cooling heat dissipation apparatus and motor controller
  • Liquid cooling heat dissipation apparatus and motor controller

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] Such as figure 2 As shown, it is a schematic diagram of side-mounted cooling of a power module in an embodiment of a liquid cooling device of the present invention, and the liquid cooling device can be used to dissipate heat for multiple power modules 60 . The liquid-cooling heat dissipation device in this embodiment includes a base plate and a cooling liquid channel 4 located in the base plate, on the base plate there is at least one heat conduction boss 21 protruding from the upper surface of the base plate, and the side of the heat conduction boss 21 has a The first installation positio...

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Abstract

The invention provides a liquid cooling heat dissipation apparatus and a motor controller. The liquid cooling heat dissipation apparatus comprises a substrate and a cooling liquid channel formed in the substrate; at least one heat conducting lug boss which protrudes out of the upper surface of the substrate is arranged on the substrate; a first mounting station used for mounting a power device is arranged on the side surface of each heat conducting lug boss; a lug boss water channel is formed in the heat conducting lug boss; and the lug boss water channel forms a part of the cooling liquid channel. By means of forming the lug boss water channel in the heat conducting lug boss and enabling the lug boss water channel to be one part of the cooling liquid channel, the heat conducting efficiency of the heat conducting lug boss can be greatly improved, and heat of the power device which is mounted on the surface of the heat conducting lug boss from the side surface can be taken away rapidly.

Description

technical field [0001] The invention relates to the field of motor controllers, and more specifically, to a liquid-cooled heat dissipation device and a motor controller. Background technique [0002] In motor controllers (such as electric vehicle controllers), in order to ensure the normal operation of heating modules such as IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor), it is necessary to use a water-cooled radiator to avoid excessive temperature rise. [0003] In the motor controller of electric vehicles, power devices are generally installed in two ways: flat mounting and side mounting. In many cases, in order to improve space utilization and reduce the volume of the whole machine, a vertical side installation structure is usually adopted. [0004] Such as figure 1 As shown in , it is a schematic diagram of side-mounted cooling for common power modules. The cooling liquid channel 14 is located between the structural member 12 and the seal...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/473
CPCH01L23/367H01L23/473
Inventor 邵兆军王帮伟雷道伟
Owner SUZHOU INOSA UNITED POWER SYST CO LTD
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