Substrate support module for excimer laser annealing equipment

Abstract

The present invention relates to a substrate supporting module for an excimer laser annealing device. The present invention is a substrate supporting module for an excimer laser annealing device. The substrate supporting module for an excimer laser annealing device includes: a workbench for placing a substrate; The lower direction is arranged to pass through the above-mentioned workbench, which is used to load the substrate on the workbench or unload the substrate from the workbench; and the lifting drive part is used to lift the above-mentioned bracket, and the above-mentioned excimer laser annealing device is used. It is characterized in that the workbench is divided into predetermined areas, and each area forms a vacuum suction area independent of each other, and the vacuum suction area is sequentially vacuumed from the center of the workbench, so that it is sequentially connected to the above-mentioned substrate from the center of the above-mentioned substrate. contact with the workbench.

Description

technical field [0001] The present invention relates to a substrate support module for an excimer laser annealing (Excimer Laser Annealing) device, and relates to a substrate support module for an excimer laser annealing device in which a table for placing a substrate is divided into predetermined areas to form independent vacuum suction areas , so that vacuum suction is performed sequentially from the central portion of the workbench, thereby preventing the generation of air bubbles between the substrate and the workbench, thereby minimizing the warp phenomenon of the substrate. Background technique [0002] Generally, methods for crystallizing a substrate or a thin film include forming the substrate or thin film on a stage inside a chamber, performing annealing at a high temperature, or depositing a thin film on the substrate at a high temperature. In the present invention, the above-mentioned annealing of the substrate or thin film and the thin film evaporation process un...

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Problems solved by technology

[0003] However, the annealing at the above-mentioned high temperature has disadvantages of contaminating the interior of the chamber by thermochemical reactions in the high-temperature atmosphere, or generating unnecessary compounds inside the chamber, thereby causing contamination of the substrate.

[0004] Also, there are disadvantages in that the heat treatment uniformity is not constant due to the uneven temperature gradient, thereby forming spots (mura) on the substrate or film, or consuming a lot of time for adjusting the high-temperature atmosphere, resulting in an increase in process cost, and low productivity

During this process, there is a high probability that air bubbles cannot be completely removed, which still leads to a decrease in the quality of the substrate

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