Substrate supporting module for excimer laser annealing apparatus

A technology of excimer laser and annealing device, which is applied in the quasi field, can solve the problems of lower substrate quality, low productivity, and increased process cost, and achieve the effect of minimizing the generation of bubbles and minimizing the contact area

Active Publication Date: 2017-09-12
AP SYST INC
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Problems solved by technology

[0003] However, the annealing at the above-mentioned high temperature has disadvantages of contaminating the interior of the chamber by thermochemical reactions in the high-temperature atmosphere, or generating unnecessary compounds inside the chamber, thereby causing contamination of the substrate.
[0004] Also, there are disadvantages in that the heat treatment uniformity is not constant due to the uneven temperature gradient, thereby forming spots (mura) on the substrate or film, or consuming a lot of time for adjusting the high-temperature atmosphere, resulting in an increase in process cost, and low productivity
During this process, there is a high probability that air bubbles cannot be completely removed, which still leads to a decrease in the quality of the substrate

Method used

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  • Substrate supporting module for excimer laser annealing apparatus
  • Substrate supporting module for excimer laser annealing apparatus
  • Substrate supporting module for excimer laser annealing apparatus

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Embodiment Construction

[0035] The present invention relates to a substrate supporting module for an excimer laser annealing device, which divides a workbench for placing a substrate into predetermined areas to form independent vacuum suction areas, so that vacuum suction is performed sequentially from the central part of the workbench, so that the above-mentioned substrate The central part of the substrate is sequentially in contact with the above-mentioned table, thereby preventing the generation of air bubbles between the substrate and the table, and minimizing the bending phenomenon of the substrate.

[0036] In addition, a grid-shaped pattern is formed on the upper part of the workbench to minimize the contact area between the workbench and the substrate, and to make the flow of air smooth to minimize the temperature gradient of the substrate, thereby minimizing the occurrence of spots on the substrate , so that high-quality substrates can be obtained.

[0037] Hereinafter, the present invention w...

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Abstract

The present invention relates to a substrate supporting module for an excimer laser annealing ELA apparatus. The substrate support module includes a stage on which a substrate is placed, a support vertically penetrating the stage for loading or unloading the substrate on the stage, and an elevating driving part used for elevating the support. The substrate support module is characterized in that the stage is divided into predetermined regions which form mutually independent vacuum suction regions; and the vacuum suction regions successively carry out vacuum suction from the central part of the stage so as to be in contact with the stage successively from the central part of the substrate.

Description

technical field [0001] The present invention relates to a substrate support module for an excimer laser annealing (Excimer Laser Annealing) device, and relates to a substrate support module for an excimer laser annealing device in which a table for placing a substrate is divided into predetermined areas to form independent vacuum suction areas , so that vacuum suction is performed sequentially from the central portion of the workbench, thereby preventing the generation of air bubbles between the substrate and the workbench, thereby minimizing the warp phenomenon of the substrate. Background technique [0002] Generally, methods for crystallizing a substrate or a thin film include forming the substrate or thin film on a stage inside a chamber, performing annealing at a high temperature, or depositing a thin film on the substrate at a high temperature. In the present invention, the above-mentioned annealing of the substrate or thin film and the thin film evaporation process un...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67115H01L21/6838
Inventor 沈亨基李基雄金戊一金利镐
Owner AP SYST INC
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