Substrate supporting module for excimer laser annealing apparatus

Abstract

The present invention relates to a substrate supporting module for an excimer laser annealing ELA apparatus. The substrate support module includes a stage on which a substrate is placed, a support vertically penetrating the stage for loading or unloading the substrate on the stage, and an elevating driving part used for elevating the support. The substrate support module is characterized in that the stage is divided into predetermined regions which form mutually independent vacuum suction regions; and the vacuum suction regions successively carry out vacuum suction from the central part of the stage so as to be in contact with the stage successively from the central part of the substrate.

Description

technical field [0001] The present invention relates to a substrate support module for an excimer laser annealing (Excimer Laser Annealing) device, and relates to a substrate support module for an excimer laser annealing device in which a table for placing a substrate is divided into predetermined areas to form independent vacuum suction areas , so that vacuum suction is performed sequentially from the central portion of the workbench, thereby preventing the generation of air bubbles between the substrate and the workbench, thereby minimizing the warp phenomenon of the substrate. Background technique [0002] Generally, methods for crystallizing a substrate or a thin film include forming the substrate or thin film on a stage inside a chamber, performing annealing at a high temperature, or depositing a thin film on the substrate at a high temperature. In the present invention, the above-mentioned annealing of the substrate or thin film and the thin film evaporation process un...

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Problems solved by technology

[0003] However, the annealing at the above-mentioned high temperature has disadvantages of contaminating the interior of the chamber by thermochemical reactions in the high-temperature atmosphere, or generating unnecessary compounds inside the chamber, thereby causing contamination of the substrate.

[0004] Also, there are disadvantages in that the heat treatment uniformity is not constant due to the uneven temperature gradient, thereby forming spots (mura) on the substrate or film, or consuming a lot of time for adjusting the high-temperature atmosphere, resulting in an increase in process cost, and low productivity

During this process, there is a high probability that air bubbles cannot be completely removed, which still leads to a decrease in the quality of the substrate

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