Method for reducing friction between components of machine
A component and machine technology, applied in the field of semiconductor equipment, can solve problems such as brown marks, product center defects, damaged components, etc., to avoid mutual friction and improve service life
Inactive Publication Date: 2017-09-22
SHANGHAI HUALI MICROELECTRONICS CORP
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- Application Information
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Problems solved by technology
During this alignment process, if due to lack of experience, the double gas belt is not aligned and inserted into the hollow hole of the gas injector for many times, it will cause multiple frictions at the connection between the double gas belt and the gas injector, and Leaving brown marks, which may cause product center defects, and more serious parts may be damaged
Method used
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Embodiment Construction
[0017] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
[0018] The invention provides a method for reducing the friction between the parts of the machine, which is applied to such as Figure 1-2 Shown is a machine comprising a gas injector 2 and a double gas belt 1,
[0019] The gas injector 2 has a hollow circular hole 21, and an O-ring 22 is arranged on the inner wall of the hole 21;
[0020] The double gas belt 1 has a protruding circular cavity 11 whose diameter is not larger than that of the O-ring 22 so that the cavity 11 can be inserted into the hole 21 through the O-ring 22 .
[0021] The machine platform in the embodiment of the present invention can be Lam Kiyo machine platform, and this machine platform mainly comprises two parts: be positioned at figure 1 Gas injector 2 on the right and dual gas strip 1 on the left. Wherein, the gas in...
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The invention relates to the field of semiconductor equipment, and in particular relates to a method for reducing friction between components of a machine. The method for reducing friction between the components of the machine is applied to the machine including a gas ejector and a dual gas belt, wherein the gas ejector comprises a hollow round hole, and an O-shaped ring is arranged on the inner wall of the hole; the dual gas belt is provided with a protruded round cavity, the diameter of the cavity is not more than that of the O-shaped ring, and thus the cavity is inserted into the hole after penetrating through the O-shaped ring. According to the method provided by the invention, the O-shaped ring is arranged on the inner wall of the hole of the gas ejector, so that the cavity of the dual gas belt is prevented from being rubbed with the hole when being inserted into the hole, and thus service life is improved.
Description
technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a method for reducing friction between semiconductor equipment. Background technique [0002] In semiconductor dry etching equipment, the Kiyo process chamber uses a gas distribution system to make the gas enter the chamber uniformly. The machine side mainly includes the following components: 1) shut-off valve; 2) small gas pipeline; 3) double gas belt; 4) gas injector. Equipment engineers will involve the following actions in the daily opening and maintenance process: After inserting the circular cavity of the double gas belt into a small section of gas pipeline, align it with the hollow hole inserted into the gas injector, and then lock it with screws to tighten it. Solid dual gas belt and gas injectors. During this alignment process, if due to lack of experience, the double gas belt is not aligned and inserted into the hollow hole of the gas injector for many times, it...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01J37/32
CPCH01J37/3244H01J37/32513H01J2237/334
Inventor 冯翔冯俊杰朱骏张旭升刘东升彭国发
Owner SHANGHAI HUALI MICROELECTRONICS CORP