Imaging device, imaging device component and electronic device
An imaging device and mounting shell technology, applied in the fields of electronic devices and imaging devices, can solve the problems of high temperature, affect user experience, affect the normal operation of the camera, etc., and achieve the effects of ensuring normal operation, improving user experience, and increasing heat dissipation area.
Pending Publication Date: 2017-09-29
SHENZHEN HEYTAP TECHNOLOGY CO LTD
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Problems solved by technology
[0002] In electronic devices with shooting functions such as mobile phones, the heat generated by the camera is concentrated, making the temperature of the outer surface of the electronic device corresponding to the camera higher, which affects the user experience and may affect the normal operation of the camera
Method used
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[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0030] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating ...
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The invention discloses an imaging device, an imaging device component and an electronic device. The imaging device comprises a shell; a camera module accommodated in the shell; a flexible circuit board connected with the camera module, wherein the flexible circuit board comprises an extension part extending out from the shell; a first heat dissipation layer wrapping the shell; and a second heat dissipation layer wrapping the extension part, wherein the second heat dissipation layer is connected with the first heat dissipation layer, the first heat dissipation layer is provided with a through hole, the shell is partially exposed through the through hole, and the shell is grounded through the through hole. In the imaging device, the imaging device component and the electronic device, the first heat dissipation layer and the second heat dissipation layer increase the heat dissipation area of the imaging device, therefore the heat of the imaging device can be quickly transferred to the outside, the relatively high temperature on the outer surfaces of the electronic device and the imaging device is avoided, which is conducive to improving the user experience and ensuring the normal work of the imaging device. In addition, the shell is grounded to prevent static electricity on the shell to affect the communication signal of the electronic device.
Description
technical field [0001] The present invention relates to the field of terminals, in particular to an imaging device, an imaging device component and an electronic device. Background technique [0002] In an electronic device with a shooting function such as a mobile phone, the heat generated by the camera is concentrated, which makes the temperature of the outer surface of the electronic device corresponding to the camera higher, which affects user experience and may affect the normal operation of the camera. Contents of the invention [0003] The invention provides an imaging device, an imaging device component and an electronic device. [0004] The imaging device in the embodiment of the present invention includes a housing; a camera module accommodated in the housing; a flexible circuit board connected to the camera module, the flexible circuit board includes an extension protruding from the housing; The first heat dissipation layer of the shell; and the second heat dis...
Claims
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Login to View More IPC IPC(8): H04N5/225G03B17/55
CPCG03B17/55H04N23/50H04N23/51H04N23/57H04N23/45
Inventor 吕向楠
Owner SHENZHEN HEYTAP TECHNOLOGY CO LTD