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Solder paste preparing equipment for manufacturing head lamp

A lighting and solder paste technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of solder paste bubbles, a large number of bubbles, etc.

Inactive Publication Date: 2017-10-20
GRACE(NINGBO) LIGHTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing solder paste preparation equipment on the market has the problem that a large number of air bubbles are easily generated in the preparation of solder paste
[0003] To sum up, it is necessary to develop a solder paste preparation equipment for making lighting lamps without bubbles in solder paste preparation, so as to overcome the disadvantage that a large number of air bubbles are easily generated in the preparation of solder paste in the prior art.

Method used

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  • Solder paste preparing equipment for manufacturing head lamp
  • Solder paste preparing equipment for manufacturing head lamp
  • Solder paste preparing equipment for manufacturing head lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A kind of solder paste preparation equipment for making lighting lamps, such as Figure 1-4 As shown, it includes a mounting frame 1, a box body 2, a first bearing 3, a rotating device 4, a first rotating shaft 5, a blade 6, a discharge pipe 7, a first valve 8, a feed pipe 9 and a second valve 10, The center of the inner bottom of the mounting frame 1 is provided with a box body 2, the center of the top of the box body 2 is provided with a first bearing 3, the first bearing 3 is provided with a first rotating shaft 5, and the inner top of the mounting frame 1 is provided with a rotating device 4, and the rotating device 4 Connected to the top of the first rotating shaft 5, the middle and lower part of the first rotating shaft 5 is provided with a blade 6, the lower part of the left wall of the box body 2 is provided with a discharge pipe 7, and the discharge pipe 7 is provided with a first valve 8, and the right side of the top of the box body 2 A feed pipe 9 is provide...

Embodiment 2

[0030] A kind of solder paste preparation equipment for making lighting lamps, such as Figure 1-4 As shown, it includes a mounting frame 1, a box body 2, a first bearing 3, a rotating device 4, a first rotating shaft 5, a blade 6, a discharge pipe 7, a first valve 8, a feed pipe 9 and a second valve 10, The center of the inner bottom of the mounting frame 1 is provided with a box body 2, the center of the top of the box body 2 is provided with a first bearing 3, the first bearing 3 is provided with a first rotating shaft 5, and the inner top of the mounting frame 1 is provided with a rotating device 4, and the rotating device 4 Connected to the top of the first rotating shaft 5, the middle and lower part of the first rotating shaft 5 is provided with a blade 6, the lower part of the left wall of the box body 2 is provided with a discharge pipe 7, and the discharge pipe 7 is provided with a first valve 8, and the right side of the top of the box body 2 A feed pipe 9 is provide...

Embodiment 3

[0033] A kind of solder paste preparation equipment for making lighting lamps, such as Figure 1-4As shown, it includes a mounting frame 1, a box body 2, a first bearing 3, a rotating device 4, a first rotating shaft 5, a blade 6, a discharge pipe 7, a first valve 8, a feed pipe 9 and a second valve 10, The center of the inner bottom of the mounting frame 1 is provided with a box body 2, the center of the top of the box body 2 is provided with a first bearing 3, the first bearing 3 is provided with a first rotating shaft 5, and the inner top of the mounting frame 1 is provided with a rotating device 4, and the rotating device 4 Connected to the top of the first rotating shaft 5, the middle and lower part of the first rotating shaft 5 is provided with a blade 6, the lower part of the left wall of the box body 2 is provided with a discharge pipe 7, and the discharge pipe 7 is provided with a first valve 8, and the right side of the top of the box body 2 A feed pipe 9 is provided...

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Abstract

The invention relates to a preparation equipment, in particular to a preparation equipment for solder paste for illuminating lamps. The technical problem to be solved by the present invention is to provide a solder paste preparation equipment for making lighting lamps without bubbles in solder paste preparation. In order to solve the above technical problems, the present invention provides such a solder paste preparation equipment for making lighting lamps, which includes a mounting frame, a box body, a first bearing, a rotating device, a first rotating shaft, blades, etc.; There is a box body, the first bearing is arranged in the center of the top of the box body, the first rotating shaft is arranged in the first bearing, the rotating device is arranged on the top of the installation frame, the rotating device is connected with the top of the first rotating shaft, and the middle and lower part of the first rotating shaft is provided with blades , The lower part of the left wall of the box is provided with a discharge pipe. In the present invention, through the non-stop forward and reverse rotation of the box body, the mixing force of the raw materials is increased, the mixing efficiency of the equipment is improved, and the production time is saved, and the second spring cooperates with the steel ball.

Description

technical field [0001] The invention relates to a preparation equipment, in particular to a preparation equipment for solder paste for illuminating lamps. Background technique [0002] Solder paste is a gray paste. Solder paste is a new type of soldering material that emerged with SMT. It is a paste formed by mixing solder powder, flux, and other surfactants and thixotropic agents. mixture. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. However, the existing solder paste preparation equipment on the market has the problem that a large number of air bubbles are easily generated in the preparation of solder paste. [0003] To sum up, there is a need to develop a solder paste preparation equipment for making lighting lamps without air bubbles in solder paste preparation, so as to overcome the disadvantage that a large number of air bubbles are easily generated in the solder paste preparation in the prior...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 张晓艳
Owner GRACE(NINGBO) LIGHTING CO LTD
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