A computer mainframe placement device for uniform heat dissipation
A technology of uniform heat dissipation and computer, applied in the computer field, can solve the problem of slow running of the host, and achieve the effect of improving work efficiency, improving service life and making life convenient
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[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0017] see Figure 1-2 , the present invention provides a technical solution: a computer mainframe placement device for uniform heat dissipation, including a base 1, a support rod 2 is fixedly connected to the top of the base 1, and a support plate 3 is fixedly connected to one side of the support rod 2, and the support plate The top of 3 is fixedly connected with motor 4, and the top of support bar 2 is fixedly connected with fixed plate 5, and the bottom of ...
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