Efficient cooling device of sealed case and sealed case

Abstract

The embodiment of the invention provides an efficient cooling device of a sealed case and the sealed case. The efficient cooling device comprises a case wallboard, inner cooling fins, outer cooling fins, inner cooling fans and outer cooling fans; the inner cooling fins are fixedly arranged on the inner side surface of the case wallboard; the outer cooling fins are fixedly arranged on the outer side surface of the case wallboard; air inlets of the inner cooling fans are communicated with the inner side of the case wallboard, and inner air guide grooves are formed between air outlets of the inner cooling fans and the inner cooling fins; air inlets of the outer cooling fans are communicated with the outer side of the case wallboard, and outer air guide grooves are formed between air outlets of the outer cooling fans and the outer cooling fins. In the technical scheme, the effective cooling area and the heat convection coefficient are increased, under the action of the inner cooling fans and the outer cooling fans, generated air flow flows through the inner air guide grooves and the outer air guide grooves, forced convection is formed, the temperature distribution of the case wallboard can be more uniform, and therefore the cooling efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a high-efficiency heat dissipation device for a sealed cabinet and the sealed cabinet. Background technique [0002] Chassis-type devices (such as codecs, servers, desktop computer hosts, etc.) will generate more heat when they are working. If the heat generated cannot be dissipated in time, it will easily cause damage to some components in the chassis. For example, at present, the heat dissipation of most sealed chassis devices is carried out through the fan or cooling pipe that comes with the motherboard. Specifically, the heat is transferred to the wall of the chassis under the action of the fan or cooling pipe that comes with the motherboard. The inner side of the board is then transferred to the outer side of the chassis wall through heat conduction, and finally the heat is dissipated from the outer side of the chassis wall into the air through natural heat conducti...

AI Technical Summary

Problems solved by technology

However, under normal circumstances, the heat dissipation capacity of the built-in fan of the motherboard is insufficient, which may easily lead to uneven temperature distribution in the chassis and the temperature of the chassis wall, thus affecting the overall heat dissipation efficiency of the device.

In addition, although the heat conduction efficiency of the cooling pipe is high, the cooling pipe can only transfer heat to a part of the chassis wall, which is more likely to cause uneven temperature distribution on the chassis wall and affect the overall heat dissipation efficiency of the equipment.

[0003] It can be seen that the sealed chassis equipment in the prior art has at least the following heat dissipation problems: during the heat dissipation process, the temperature distribution of the chassis wall plate is uneven, resulting in low heat dissipation efficiency

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