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A window type ball grid array package assembly

A ball grid array and packaging component technology, which is applied in the field of semiconductor memory components, can solve the problems affecting chip fixing, cracks, and contact area reduction, etc., and achieves the effect of fixing the chip and increasing the adhesive area.

Active Publication Date: 2018-05-22
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the chip is shifted due to inaccurate positioning or other reasons, the floating area may increase, such as Figure 4 As shown, the chip 130 will produce cracks at the edge of the adhesive layer 120 due to stress concentration, and the contact area between the chip 130 and the adhesive layer 120 will also become smaller, which will affect the fixing of the chip.

Method used

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  • A window type ball grid array package assembly
  • A window type ball grid array package assembly
  • A window type ball grid array package assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Such as Figure 5 As shown, the window type ball grid array package component of this embodiment includes: a substrate 210 having opposite first surfaces 211 and second surfaces 212, and a window 213 penetrating through the first surface 211 and the second surface 212 is formed; The adhesive layer 220 is formed on the second surface 212 of the substrate 210; the chip 230 is fixed on the second surface 212 of the substrate 210 through the adhesive layer 220; the bonding wire 240 passes through the window 213 and electrically connects the chip 220 and the substrate 210 ; the plastic package 250 is formed on the second surface 212 of the substrate 210 and in the window 213 to wrap the chip 220 and the bonding wire 240 ; and the solder ball 260 is planted on the first surface 211 of the substrate 210 .

[0067] Such as Figure 5 and Figure 6 As shown, the adhesive layer 220 of this embodiment includes a first adhesive surface 221 and a second adhesive surface 222 located...

Embodiment 2

[0072] The difference between the window type ball grid array package assembly of this embodiment and the first embodiment is the structure of the adhesive layer.

[0073] Such as Figure 8 As shown, the adhesive layer 320 of this embodiment includes a first adhesive surface 321 and a second adhesive surface 322 located on both sides of the substrate window 213, and the inner edges 323 and 324 near the window 213 each have three circular arcs. Convex shape, the outer edges 325 and 326 away from the window 213 are protruding shapes covered with circular arcs.

[0074] Such as Figure 9 shown, compared to Figure 8 , the vertical mapping profile 233 of the chip 230 is displaced in the negative direction of the X-axis of the substrate 210, that is, the chip 230 is displaced in the negative direction of the X-axis before injection molding. The protrusion can make the contact surface of the inner edge 323 and 324 and the outer edge 325 of the plastic package covering the adhesiv...

Embodiment 3

[0079] The difference between the window type ball grid array package assembly of this embodiment and the first embodiment is the structure of the adhesive layer. Such as Figure 12 As shown, the adhesive layer 420 includes a first adhesive surface 421 and a second adhesive surface 422 located on both sides of the substrate window 213, the inner edges 323 and 324 near the window 213, the outer edges 325 and 326 away from the window 213, and the lateral Edges 428 and 429 are in the shape of rounded protrusions. From the vertical mapping profile 233 of the chip 220, it can be seen that the chip 230 has been displaced in the negative direction of the X axis and the negative direction of the Y axis before injection molding. The contact surfaces of the inner edges 423 and 424, the outer edges 425, and the lateral edges 428 of the plastic package covering the adhesive layer 420 are non-linear extensions, rather than a continuous surface of stress, so as to disperse the stress and p...

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PUM

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Abstract

The invention provides a window-type ball grid array package assembly, comprising: a substrate having opposite first and second surfaces, and a window penetrating through the first and second surfaces is formed; an adhesive layer is formed on the substrate On the second surface; the chip is fixed on the second surface of the substrate through the adhesive layer; the welding wire passes through the window and electrically connects the chip and the substrate; the plastic package is formed on the second surface of the substrate and in the window, to Wrapping the chips and bonding wires; and soldering balls planted on the first surface of the substrate; wherein, the contact surface of the edge of the plastic package covering the adhesive layer extends nonlinearly. The invention can avoid the problem of chip cracking due to stress concentration during the injection molding process, especially can avoid the problem of chip cracking when the chip is displaced, and at the same time can increase the adhesive area to better fix the chip.

Description

technical field [0001] The present invention relates to semiconductor storage components, in particular to a window ball grid array (Window Ball Grid Array, WBGA) packaging component. Background technique [0002] Among the package types of semiconductor devices, the window type ball grid array package structure is to open a through window for the substrate carrying the chip, so that the bonding wire can pass through the window and electrically connect the substrate and the chip. [0003] Such as figure 1 As shown, a known window type BGA package assembly 100 includes a substrate 110 having a window 113 , an adhesive layer 120 , a chip 130 , bonding wires 140 , a plastic package 150 and solder balls 160 . Substrate 110 has opposite first surface 111 and second surface 112, and adhesive layer 120 comprises first adhesive surface 121 and second adhesive surface 122 on both sides of window 113, and chip 130 is fixed on substrate by adhesive layer 120 On the second surface 112...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31
CPCH01L23/3107H01L23/3114H01L23/3128H01L2224/32225H01L2224/48091H01L2224/4824H01L2224/73215H01L2924/15311H01L2924/181H01L2924/00014H01L2924/00012H01L2924/00
Inventor 庄凌艺
Owner CHANGXIN MEMORY TECH INC