Unlock instant, AI-driven research and patent intelligence for your innovation.

Drawing method of robust ball-grid-array-structured chip

A ball grid array and structure chip technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as drawing methods without a ball grid array structure chip

Active Publication Date: 2017-12-01
HARBIN INST OF TECH
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the prior art does not have a drawing method for a ball grid array chip

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Drawing method of robust ball-grid-array-structured chip
  • Drawing method of robust ball-grid-array-structured chip
  • Drawing method of robust ball-grid-array-structured chip

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0024] Specific implementation mode one: combine Figure 1 to Figure 6 Specifically explain this embodiment, a method for drawing a robust ball grid array chip described in this embodiment, the method includes the following steps:

[0025] Step 1. Teaching and testing the BGA chip to obtain the parameter information of the chip;

[0026] Step 2. Draw the outline of the chip body according to the X-direction size m_Body_X and the Y-direction size m_Body_Y of the chip body part in the parameter information obtained in step 1. The body outline is a green rectangle;

[0027] Step 3. Draw the chip solder ball group to get the opengl drawing matrix:

[0028] According to the parameter information obtained in step 1, it is judged whether the chip has a vacant block. When the chip has no vacant block, first move the drawing origin to the position of the solder ball in the upper left corner of the chip body outline, and draw a red circle at the current coordinate position. The radius...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a drawing method of a robust ball-grid-array-structured chip, relates to the field of ball-grid-array-structured chips, and aims to satisfy the drawing requirements of the ball-grid-array-structured chips. The method includes: performing demonstration and testing on the chip to obtain the parameter information of the chip, drawing a chip body contour, drawing chip solder ball groups to obtain a drawing matrix, and translating and rotating the drawing matrix. The drawing method applicable to the drawing of the robust ball-grid-array-structured chip has the advantages that an operator can visually see the chip surface-mounting data and detecting results through the chip pattern obtained by the method, and chip surface mounting precision is guaranteed.

Description

technical field [0001] The invention relates to the field of ball grid array structure chips. Background technique [0002] A placement machine with a vision system is a complex industrial machine that requires extremely high placement accuracy. Before the machine starts to mount, it is necessary to import the mounting data on the software interface in advance. The mounting data includes the center position and rotation angle of each chip. A convenient way to verify whether the data is correct is to draw the outline of the chip based on the data and compare it with the real position of the chip on the PCB. The accuracy of mounting data has a great influence on the mounting accuracy of chips. [0003] In the actual production process, before the nozzle head sucks up the chip from the feeder and sticks the chip on the PCB, the chip needs to be tested. The test result directly determines the placement accuracy of the chip. Drawing chips can effectively display the tested chi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/392
Inventor 高会军杨宪强张智浩白立飞孙光辉于金泳
Owner HARBIN INST OF TECH