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A Superjunction MOSFET Device with Guard Ring

A protection ring and device technology, applied in semiconductor devices, electrical components, transistors, etc., can solve problems such as device failure, improve reliability, avoid parasitic transistors from turning on, and improve the ability to resist UIS failure.

Active Publication Date: 2019-08-02
HANGZHOU SILICON-MAGIC SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a super junction MOSFET device with high anti-UIS failure capability in order to solve the device failure problem of the super junction MOSFET device due to the parasitic triode being turned on

Method used

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  • A Superjunction MOSFET Device with Guard Ring
  • A Superjunction MOSFET Device with Guard Ring
  • A Superjunction MOSFET Device with Guard Ring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1As shown, this embodiment provides a super junction MOSFET device with a guard ring, which is characterized in that its active region has at least one cell array formed by several cells and surrounding the cell array The combined unit formed by the guard ring, the structure of any unit cell includes a metallized drain 1, a first conductivity type semiconductor doped substrate 2, a first conductivity type semiconductor doped epitaxial region 3, a second conductivity type semiconductor from bottom to top. Type semiconductor doped body region one 6, gate and metallized source 11, wherein: the second conductivity type semiconductor doped column region 4 arranged at intervals in the first conductivity type semiconductor doped epitaxial region 3 forms a super junction structure; the lower surface of the second conductivity type semiconductor doped column region 4 coincides with the upper surface of the first conductivity type semiconductor doped substrate 2; t...

Embodiment 2

[0030] The structure of the present invention is the same as that of Embodiment 1 except that the width of the second conductivity type semiconductor ring region 5 is greater than the width of the second conductivity type semiconductor column region 4 .

[0031] Based on the above description of the principle, it can be deduced that increasing the charge imbalance in the semiconductor ring region 5 of the second conductivity type is beneficial to fix the avalanche breakdown point.

[0032] In the above embodiments, the present invention does not limit the number of cells, and the number of cells in the cell array surrounded by the guard ring structure is defined as n (n≧1), and the value of n can be determined according to the required on-resistance of the device. and current capability are designed.

[0033] In the above embodiments, the present invention does not limit the number of combination units composed of a cell array and a guard ring structure surrounding the cell ar...

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Abstract

The invention provides a super junction MOSFET device with a guard ring, which belongs to the technical field of power devices. In the active region of the device of the present invention, there is at least one combined unit composed of a cell array and a guard ring surrounding the periphery of the cell array; the structure of any cell includes a metallized drain, a substrate, an epitaxy region, column region and body region 1, gate and metallized source, the epitaxial region on the periphery of the cell array is also provided with ring region and body region 2, body region 1, body region 2, pillar region The conductivity type of the ring region is opposite to that of the epitaxial region. By reasonably controlling the doping amount of the ring region compared with the column region, the charge imbalance at the guard ring is caused, thereby changing the avalanche breakdown path and fixing the avalanche breakdown point at the guard ring, preventing the avalanche current from flowing through the base resistance of the parasitic triode. is turned on, thereby improving the ability of the super-junction power device to resist UIS failure, thereby improving the reliability of the super-junction power device.

Description

technical field [0001] The invention belongs to the technical field of power semiconductors, and in particular relates to a super junction MOSFET device with a guard ring. Background technique [0002] Power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) plays an important role in various power conversions, especially high-frequency power conversions, due to its advantages of high switching speed, low switching loss, and low driving loss. Switching under unclamped inductive loads is generally considered to be the most extreme electrical stress situation that power devices can experience in system applications. Because the energy stored in the inductance when the loop is turned on must be released by the power device at the moment of turning off. The high voltage and high current applied to power devices at the same time can easily cause device failure. Avalanche tolerance is an important parameter to measure the device's ability to resist UIS failure. There is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/088H01L29/06
CPCH01L27/088H01L29/0626
Inventor 任敏罗蕾李佳驹谢驰李泽宏张波
Owner HANGZHOU SILICON-MAGIC SEMICON TECH CO LTD