Electric relay with thermal structure

A heat dissipation structure and relay technology, applied in relays, electromagnetic relays, electromagnetic relay details and other directions, can solve problems such as reducing the life of solid state relays, and achieve the effects of simple structure, extended service life, and easy disassembly

Active Publication Date: 2017-12-15
明光市欣大电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The input terminal of the solid-state relay uses a small control signal to directly drive a large current load. The solid-state relay in the prior art includes a housing and relay components in the housing. For equipment requirements, solid-state relays often need to be installed in high-temperature working environments. environment, working for a long time will reduce the life of the solid state relay

Method used

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  • Electric relay with thermal structure
  • Electric relay with thermal structure

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Embodiment Construction

[0014] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them.

[0015] refer to Figure 1-2 , a relay with a heat dissipation structure, including a first housing 12 and a second housing 17, the top of the first housing 12 is opened and matched with the second housing 17, and the inner bottom surface of the first housing 12 is provided with The circuit board 13, the outside of the first casing 12 is provided with a plurality of mounting grooves 16 and arranged in a symmetrical manner, each mounting groove 16 is provided with an electrode piece 14, and the electrode piece 14 is connected to the first through a locking screw 15. The casing 12 is fixedly connected, and the circuit board 13 is connected to a plurality of ...

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Abstract

The invention involves the technical field of electric relay, in particular to an electric relay with thermal structure, the electric relay with thermal structure comprises a first shell and a second shell, wherein an opening is formed on the top of the first shell and matched to install the second shell, the inside of which is matched to install an electric fan, a plurality of fixing plates are mounted on the outside of the second shell, the bottom of the fixing plates are equipped with external thread tubes, the bottom ends of which are inserted with support rods, the bottom ends of the support rods are installed on the upper surface of the first shell, a plurality of chutes are formed on the sides of the support rods which are sleeved with internal thread tubes, one ends of the internal threaded tubes are screwed to external threaded tubes, and ring pieces are arranged below the internal threaded tubes. The electric relay has the advantages of simple structure and convenient use, not only for dissipating the heat inside the relay, thereby prolonging service life of the relay, but also facilitating the disassembly and installation of the second shell and the first shell.

Description

technical field [0001] The invention relates to the technical field of relays, in particular to a relay with a heat dissipation structure. Background technique [0002] Solid state relays are non-contact switches composed of microelectronic circuits, discrete electronic devices, and power electronic power devices. Isolation device is used to realize the isolation of control terminal and load terminal. The input terminal of the solid-state relay uses a small control signal to directly drive the high-current load. The solid-state relay in the prior art includes the housing and the relay components in the housing. In order to meet the requirements of the equipment, the solid-state relay often needs to be installed in a high-temperature working environment. Under the environment, working for a long time will reduce the life of the solid state relay. Contents of the invention [0003] The object of the present invention is to solve the shortcoming that the service life of the...

Claims

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Application Information

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IPC IPC(8): H01H45/12H01H45/04H01H50/12H01H50/04
CPCH01H45/04H01H45/12H01H50/041H01H50/12
Inventor 李丹
Owner 明光市欣大电子有限公司
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