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Chip card module and method for producing a chip card module

A technology of chip card and chip, which is applied in the direction of printed circuit manufacturing, record carrier used by machines, instruments, etc., and can solve the problem of wasting circuit board space and so on

Active Publication Date: 2020-09-29
INFINEON TECH AUSTRIA AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] When using conventional Nano-SIM-chip card modules for fixed mounting on or into circuit boards (e.g. by means of surface mounting, also known as SMT (English: Surface Mount Technology), the chip card module is larger than the actual required (e.g. more than 30% at most), such that board space is wasted

Method used

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  • Chip card module and method for producing a chip card module
  • Chip card module and method for producing a chip card module
  • Chip card module and method for producing a chip card module

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Embodiment Construction

[0046] In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which are shown for purposes of illustration specific embodiments in which the this invention. In this regard, directional terms such as "above", "below", "forward", "rear", "front", "rear", etc. are used with reference to the orientation of the figure(s) being described. Because components of the embodiments can be positioned in a variety of different orientations, the directional terms are used for description and not for any limitation. It is to be understood that other embodiments can be utilized and structural or logical changes can be made without departing from the scope of the present invention. It goes without saying that features of the different exemplary embodiments described here can be combined with one another, unless otherwise specified. Therefore, the following detailed description should not be interpreted in a limiting sense, and th...

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Abstract

A chip card module is provided in various embodiments. The chip card module can have a chip card module-contact array with six contact pads arranged in two rows according to ISO 7816, the two rows each having three contacts pads; and three additional contact pads disposed between the two rows, wherein each additional contact pad can be electrically connected to a contact pad associated with a respective one of the two rows.

Description

technical field [0001] The invention relates to a smart card module and a method for producing a smart card module. Background technique [0002] Conventional Nano-SIM-chip card module (the term "Nano-SIM" is used here for chip card modules standardized according to ISO 7816 with dimensions 8.8 mm x 12.3 mm or 4FF according to ETSI-specification TS 102 221 (with the same dimensions) chip card module) can typically be used in different applications, for example as a normal Nano-SIM card, for example in a chip card module slot of a mobile phone. [0003] Conventional smart cards for authentication of mobile devices can have a Nano-SIM chip card module, which can be embedded in the card body. The chip card body can have a plastic material, for example PVC. In this case, so-called active NFC functions (Near Field Communication) can be provided in the Nano-SIM-chip card module, for example in transactions with high security requirements, for example by means of mobile phone fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
CPCG06K19/07733G06K19/07743H05K1/0275H05K1/11H05K1/113H05K3/4608H05K3/4694H05K2201/086H05K2201/09663H05K2201/10098H05K2201/10719G06K19/07747G06K19/07766G06K19/07773H05K2201/09409H05K2201/09445G06K19/07722G06K19/07737G06K19/07739G06K19/07741H01R12/714H05K1/181H05K3/4007
Inventor 弗兰克·皮施纳马库斯·扬克延斯·波尔彼得·斯坦普卡
Owner INFINEON TECH AUSTRIA AG