Diaphragm integrated punching method

A film and die-cutting technology, which is applied in the optical field, can solve the problems of low efficiency of manual lamination assembly, poor lamination accuracy, and poor lamination, so as to reduce one tearing film and one lamination action, improve yield, The effect of improving the fitting accuracy

Active Publication Date: 2018-01-09
TRULY SEMICON
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  • Abstract
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AI Technical Summary

Problems solved by technology

Artificial lamination includes two actions of tearing the protective film and laminating. Although the cost of manual lamination is reduced, due to the low assembly efficiency and poor lamination accuracy of manual lamination, it leads to poor lamination and low yield, which cannot meet certain requirements. Fitting work when quality, efficiency, precision, etc. are required

Method used

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Embodiment Construction

[0026] The present invention will be described in detail below in conjunction with examples, which are only preferred implementations of the present invention, and are not limitations of the present invention.

[0027] Aiming at the backlight production with small production volume and the need to use artificial film sticking, in order to improve production efficiency and improve lamination accuracy, the present invention provides a film-integrated die-cutting method, which includes the following steps:

[0028] A punching method for an integrated diaphragm, comprising the following steps:

[0029] S1: Composite protective film and bottom mold on both sides of the diffuser;

[0030] S2: see image 3 , use the first knife die to perform the first die-cutting and waste discharge from the protective film to the diffusion sheet; specifically, during the first die-cutting, the contour B is die-cut on the protective film, and the contour C is die-cut on the diffusion sheet , to di...

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Abstract

The invention discloses a diaphragm integrated punching method comprising the following steps: S1, respectively compositing a protection film and a bed die on two sides of a diffusion sheet; S2, usinga first knife mold to make a first die cutting and discharging waste, wherein the first knife mold blade comprises an external blade and an internal blade, the internal blade enclosed shape is same with that of a display panel visual zone, and the external and internal blades are different in depths; punching positioning holes on the bed die edge in the first die cutting; S3, compositing a shading tape with a release PET film on the protection film, and using a second knife mold to make a second die cutting and discharging waste; S4, using a third knife mold to make a third time die cutting and discharging waste, thus forming the integrated diaphragm. The method can improve the pasting efficiency, and the shade and the lower layer can be composited by a bonding sheet, thus saving one filmtearing motion and one pasting motion, improving the assembling efficiency, improving the bonding precision, reducing adverse fitting caused by separated pasting, and improving the yield rate.

Description

technical field [0001] The invention relates to the field of optical technology, in particular to an integrated punching method for membranes. Background technique [0002] In general, the main optical film materials in the backlight module, such as light-shielding film, luminous film, diffusion film, and reflective film, are punched and cut separately, and assembled by the backlight factory, that is, film. There are two ways to stick film in the backlight factory, namely machine sticking film and manual sticking film. Machine filming needs to be adjusted, and the adjustment time is generally 1-2 hours, so the backlight factory will generally use manual filming for orders with an order quantity of less than 10K. Manual lamination includes two actions of tearing the protective film and lamination. Although the cost of manual lamination has been reduced, due to the low assembly efficiency and poor lamination accuracy of manual lamination, it leads to poor lamination and low y...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B1/00G02B5/00B32B7/10B32B9/00B32B38/04
Inventor 周福新赖春桃戴佳民
Owner TRULY SEMICON
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