Pressure touch structure and display device

A technology of pressure and heat dissipation structure, applied in instruments, digital data processing parts, semiconductor devices, etc., can solve the problems of increased material cost, uneven Cu heat sink, poor pressure touch effect, etc., to reduce material cost, reduce Lamination process, improve the effect of pressure touch effect

Active Publication Date: 2020-04-17
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The pressure touch effect is poor due to the unevenness of the Cu heat sink
In addition, the separate setting of Cu heat sink adds a bonding process and increases the cost of materials

Method used

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  • Pressure touch structure and display device
  • Pressure touch structure and display device
  • Pressure touch structure and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In order for those skilled in the art to better understand the technical solutions of the present invention, the pressure touch structure and display device provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0022] figure 1 It is a schematic structural diagram of a pressure touch structure provided by Embodiment 1 of the present invention, figure 2 for figure 1 Schematic diagram of the structure of the pressure sensor, such as figure 1 and figure 2 As shown, the pressure touch structure includes: a pressure sensor 1 and a reference layer 2, a capacitor is formed between the pressure sensor 1 and the reference layer 2, the pressure sensor 1 includes a first pattern layer 11 and a second pattern layer, and the second pattern layer includes Heat dissipation structure 12.

[0023] In this embodiment, the pressure touch structure can be applied to a display device, the display device is provided with a bat...

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PUM

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Abstract

The invention discloses a pressure touch control structure and a display device. The pressure touch structure includes a pressure sensor and a reference layer, a capacitor is formed between the pressure sensor and the reference layer, the pressure sensor includes a first pattern layer and a second pattern layer, and the second pattern layer includes a heat dissipation structure . In the technical solution of the pressure touch control structure and display device provided by the present invention, the pressure sensor includes a first pattern layer and a second pattern layer, and the second pattern layer includes a heat dissipation structure. In the present invention, the heat dissipation structure is arranged in the pressure sensor without The heat sink is installed separately from the pressure sensor, which avoids the problem of poor pressure touch effect caused by the uneven heat sink, thereby improving the pressure touch effect; there is no need to set the heat sink separately from the pressure sensor, thereby reducing a problem. The bonding process of the heat sink is separately set, and the material cost is reduced.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a pressure touch structure and a display device. Background technique [0002] With the development of touch technology, capacitive force touch technology is more and more applied to display devices. For a display device provided with a capacitive pressure touch structure, different control functions can be triggered by different touch forces. [0003] The capacitive pressure touch structure in the prior art may include a force sensor and a reference layer, the reference layer is grounded, an isolation layer is provided between the force sensor and the reference layer, and the force sensor and the reference layer form a capacitor. [0004] The capacitive pressure touch structure also includes a Cu heat sink for heat dissipation. The Cu heat sink is a separate structure in the capacitive pressure touch structure. Due to the unevenness of the Cu heat sink, the pressure ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/041G06F3/044G06F1/20
CPCG06F3/041G06F3/044G06F2203/04105G06F3/0412H01L33/64H05K1/189
Inventor 郑美珠
Owner BOE TECH GRP CO LTD
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