A kind of oled display backplane and preparation method thereof

Abstract

The invention relates to the field of display technology, and discloses an OLED display backplane and a preparation method thereof. The OLED display backplane includes a bending area and a non-bending area, and the surface of the bending area has an adhesive layer, which is formed to buffer the bend. The buffer structure of the bending stress in the bending area. The buffer structure is located at the central axis of the bending area, and the central axis of the buffering structure coincides with the central axis of the bending area. The bending area generates a large stress when it is bent. Buffer structure, and through the buffering effect of the buffer structure, the phenomenon of stress concentration of the metal wire in the bending area is avoided, which in turn can reduce the breakage of the internal metal wire when bending in the bending area, and improve the success rate of bending; the bending area Symmetrical bending can be achieved relatively easily during bending, and the bending operation can be realized more conveniently, which improves the success rate of bending, reduces the stress concentration phenomenon in the bending area, and makes it easier to form symmetrical bending, which in turn is beneficial Improve the success rate of OLED display backplane bending, and improve the mass production yield of products.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED display backplane and a preparation method thereof. Background technique [0002] With the advancement of display technology, the screens of electronic display products are becoming more and more narrow frame or even frameless, especially for OLED (Organic Light Emitting Diode) display devices. At present, flexible backplane bending is an important way to reduce the lower frame of display devices. Technical means, the narrowing of the lower frame of the OLED display backplane is mainly realized by bending the OLED display backplane. [0003] At present, when the bending process is carried out on the bending area of ​​the OLED display backplane, because the bending area generates large stress during bending, and it is easy to form sharp corners or asymmetrical bending in the bending area after bending, resulting in The stress concentration of the metal wires located in t...

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Problems solved by technology

[0003] At present, when the bending process is performed on the bending area of ​​the OLED display backplane, because the bending area generates a large stress during bending, and it is easy to form sharp corners or asymmetrical bending in the bending area after bending, resulting in The stress concentration of the metal wires located in the bending area will cause the metal wires to break, resulting in poor contact of the circuit in the backplane, affecting the success rate of bending and product yield of the OLED display backplane

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