Glue attenuation equipment for electron component dispensing

A technology of electronic components and dispensing, which is applied in coatings, devices for coating liquid on the surface, etc., and can solve problems such as cumbersome operation and incomplete collection

Inactive Publication Date: 2018-01-12
南昌安润科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the disadvantages in the prior art that insufficiently diluted glue easily affects the quality of the glue, sticking to the inner wall leads to incomplete collection and cumbersome operation, the technical problem to be solved by the present invention is to provide a fully diluted glue that can prevent sticking. Glue dilution equipment for dispensing of electronic components that fits the inner wall and is easy to operate

Method used

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  • Glue attenuation equipment for electron component dispensing
  • Glue attenuation equipment for electron component dispensing
  • Glue attenuation equipment for electron component dispensing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A kind of glue dilution equipment for dispensing of electronic components, such as Figure 1-8 As shown, it includes a base 1 , a diluting mechanism 2 and a driving mechanism 3 , the diluting mechanism 2 is connected to the top of the base 1 , and the driving mechanism 3 is connected to the right side of the top of the diluting mechanism 2 .

Embodiment 2

[0037] A kind of glue dilution equipment for dispensing of electronic components, such as Figure 1-8 As shown, it includes a base 1 , a diluting mechanism 2 and a driving mechanism 3 , the diluting mechanism 2 is connected to the top of the base 1 , and the driving mechanism 3 is connected to the right side of the top of the diluting mechanism 2 .

[0038] The dilution mechanism 2 includes a dilution box 201, a discharge pipe 202, a valve 203, a bearing seat 204, a rotating rod 205, a rotating plate 206, and a screw rod 207. Both are connected with a discharge pipe 202, the discharge pipe 202 is provided with a valve 203, the middle part of the top wall of the dilution tank 201 is connected with a bearing seat 204, the bearing seat 204 is connected with a rotating rod 205, and the rotating rod 205 passes through the bearing seat 204, The bottom end of the rotating rod 205 is connected with a rotating plate 206, and the bottom of the rotating plate 206 is uniformly connected w...

Embodiment 3

[0040] A kind of glue dilution equipment for dispensing of electronic components, such as Figure 1-8 As shown, it includes a base 1 , a diluting mechanism 2 and a driving mechanism 3 , the diluting mechanism 2 is connected to the top of the base 1 , and the driving mechanism 3 is connected to the right side of the top of the diluting mechanism 2 .

[0041] The dilution mechanism 2 includes a dilution box 201, a discharge pipe 202, a valve 203, a bearing seat 204, a rotating rod 205, a rotating plate 206, and a screw rod 207. Both are connected with a discharge pipe 202, the discharge pipe 202 is provided with a valve 203, the middle part of the top wall of the dilution tank 201 is connected with a bearing seat 204, the bearing seat 204 is connected with a rotating rod 205, and the rotating rod 205 passes through the bearing seat 204, The bottom end of the rotating rod 205 is connected with a rotating plate 206, and the bottom of the rotating plate 206 is uniformly connected w...

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Abstract

The invention relates to attenuation equipment, in particular to glue attenuation equipment for electron component dispensing. The glue attenuation equipment for electron component dispensing achievesthe technical aims that glue attenuation is sufficient, attachment to the inner wall can be prevented, and operation is convenient. In order to achieve the above technical aims, the glue attenuationequipment for electron component dispensing is provided, and comprises a base and the like; an attenuation mechanism is connected to the top of the base, and a driving mechanism is connected to the position, close to the right side, of the top of the attenuation mechanism. The glue attenuation equipment is provided with the attenuation mechanism and the driving mechanism, the aim of attenuation ofthick glue is achieved, an attenuation box and a spiral rod continuously and alternatively rotate clockwises and anticlockwises in the opposite direction, and the aim of more sufficient attenuation of the thick glue is achieved; a pedal is pedaled or released to enable ladder-shaped collision blocks on the left and right sides to collide the bottom of the attenuation box continuously, and incomplete collection caused by the fact that the thick glue is attached to the bottom of the attenuation box is avoided.

Description

technical field [0001] The invention relates to a dilution device, in particular to a glue dilution device for dispensing glue of electronic components. Background technique [0002] Electronic components are basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions, such as amplifiers, radio receivers, oscillators, etc. One of the common ways to connect electronic components is to solder them to a printed circuit board. Electronic components may be individual packages (resistors, capacitors, transistors, diodes, etc.), or groups of varying complexity, such as integrated circuits (op amps, resistors, logic gates, etc.). [0003] At present, electronic components are generally dispensed with glue, which can play the role of moisture-proof, dust-proof, corrosion-proof and shock-proof. However, if the glue for di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/10B05C11/11
Inventor 冷娇邓德华
Owner 南昌安润科技有限公司
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