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Electric connection structure

An electrical connection structure and electrical connection technology, applied in the direction of electrical connection of printed components, printed circuit components, etc., can solve problems such as unbearable flexible circuit boards, poor line adhesion, and line damage

Active Publication Date: 2018-01-12
E INK HLDG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, such an electrical connection structure has poor adhesion of the lines because the lines are in contact with the organic buffer layer, which is an organic material.
In this way, after the circuit is connected to the flexible circuit board, the circuit is easily damaged by the pulling force of the flexible circuit board, for example, the flexible circuit board is difficult to withstand a pulling force greater than 0.5N / mm

Method used

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  • Electric connection structure
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Embodiment Construction

[0029] Several implementations of the present invention will be described in the form of drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known and commonly used structures and elements will be shown in a simple and schematic manner in the drawings.

[0030] figure 1 It is a top view illustrating the electrical connection structure 100 located at the edge of the flexible display 200 according to an embodiment of the present invention. figure 2 for illustration figure 1 The cross-sectional view of the electrical connection structure 100 along the line segment 2-2. For brevity, Figure 2 to Figure 5 Both are omitted figure 1 The integrated circu...

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Abstract

The invention discloses an electric connection structure which is positioned on the edge of a flexible display. The electric connection structure comprises a flexible substrate, a first line layer, anorganic buffer layer, an organic grid separating layer and an organic protective layer, wherein the first line layer is positioned on the flexible substrate and extends to the edge of the flexible substrate, the organic buffer layer is positioned on the flexible substrate and the first line layer, so that the first line layer is positioned between the organic buffer layer and the flexible substrate, the organic grid separating layer is positioned on the organic buffer layer, the organic protective layer is positioned on the organic grid separating layer, and each of the organic protective layer, the organic grid separating layer and the organic buffer layer has two through holes, so that the first line layer is positioned partially in the through holes. Since the first line layer of the electric connection structure is positioned on the flexible substrate, instead of organic material, the adhesion force of the first line layer is improved.

Description

technical field [0001] This case involves an electrical connection structure. Background technique [0002] Generally speaking, a flexible printed circuit board (FPC) is disposed on the edge of the display device, so that the display device can receive signals and power from external electronic devices through the flexible printed circuit board. Since the traditional display device is not flexible, the flexible circuit board electrically connected to the display device is not easily pulled, and there is no need to consider the tensile strength of the flexible circuit board. However, in the organic TFT Array display device, due to its flexibility, it is necessary to consider the tensile strength of the flexible circuit board. [0003] Generally speaking, an organic thin film transistor array display device is sequentially stacked with an organic buffer layer, an organic gate isolation layer, and an organic protective layer on the edge of the flexible substrate, and an organi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/02
Inventor 林冠峄唐文忠陈柏炜许毓麟
Owner E INK HLDG INC