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Laser welding system for circuit board

A laser welding and circuit board technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of welding efficiency and accuracy to be improved, and low degree of automation

Inactive Publication Date: 2018-01-19
GUANGDONG ZHENGYE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the current circuit board laser welding system for circuit board welding has a low degree of automation, and the welding efficiency and accuracy need to be improved

Method used

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  • Laser welding system for circuit board
  • Laser welding system for circuit board
  • Laser welding system for circuit board

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Embodiment Construction

[0019] The core of the present invention is to provide a circuit board laser welding system, which has high welding efficiency and precision.

[0020] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] Please refer to figure 1 and figure 2 , figure 1 A structural schematic diagram of a specific embodiment of the circuit board laser welding system provided by the present invention; figure 2 It is a structural block diagram of a specific embodiment of the circuit board laser welding system provided by the present invention.

[0022] The circuit board laser welding system provided by the specific embodiment of the present invention includes a laser welder 2, a controller 1 for controlling the output power of the laser welder 2, a visual device 4 for locating the welding position, ...

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Abstract

The invention discloses a laser welding system for a circuit board. The laser welding system comprises a laser welder, a controller, a visual device, a wire feeding mechanism and a temperature controller, wherein the controller is used for controlling the output power of the laser welder, the visual device is used for positioning the welding position, the wire feeding mechanism is used for movinga welding wire to the welding position and conveying the welding wire; and the temperature controller is used for monitoring the welding temperature and adjusting the laser power according to the welding temperature. The laser welder, the visual device, the wire feeding mechanism and the temperature controller are all connected with the controller. During welding, under control of the controller,the visual device visually positions the welding position firstly, and then, the welding wire is moved to the welding position through the wire feeding mechanism; the laser welder emits a laser to thewelding position, and heating is started; meanwhile, the temperature controller monitors the welding position, and the output power of the laser welder is adjusted through the controller, so that thewelding temperature is kept in the set zone all the time; and the intelligent degree is high, and welding efficiency and welding precision are high.

Description

technical field [0001] The invention relates to the technical field of laser welding, in particular to a circuit board laser welding system. Background technique [0002] When the circuit board is made, it is necessary to solder various required electronic devices on the corresponding position of the circuit board. With the development of the electronics industry, the integration of circuit boards is getting higher and higher, the density of electronic devices on the circuit board is increasing, and the volume of electronic devices is getting smaller and smaller. Many electronic devices cannot withstand the overall high temperature of wave soldering and reflow soldering. , requires independent soldering, and the traditional electric soldering iron is unable to adapt to the development of the electronics industry due to its low degree of automation, low efficiency, large size of the soldering iron, and easy influence on other components. [0003] Under this premise, laser we...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/21B23K26/70
Inventor 肖磊丁黎明梅领亮徐地华
Owner GUANGDONG ZHENGYE TECH