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Inorganic glue for high temperature conditions and preparation method and application of inorganic glue

A high-temperature glue technology, applied in the field of high-temperature inorganic glue, can solve problems such as poor viscosity, limited glue usage, colloid softening and falling off, etc.

Inactive Publication Date: 2018-01-19
XIAMEN GREEN WAY ELECTRONICS TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the inorganic glues on the market have excellent effects in temperature resistance, but the viscosity is poor, and the inorganic glues will appear "moisture" after a period of use, causing the colloid to soften and fall off.
Some formula raw materials selected by the existing inorganic glue generally have one or two kinds of raw materials with large particles and low mesh number, which is easy to cause the precipitation and stratification of large particles of glue, and the existence of large particles limits the glue How to use and smaller items can't use glue

Method used

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  • Inorganic glue for high temperature conditions and preparation method and application of inorganic glue
  • Inorganic glue for high temperature conditions and preparation method and application of inorganic glue

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Embodiment Construction

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and clearer, the present invention will be further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] An inorganic glue for high temperature, comprising dry powder and sodium silicate solution with a ratio of 1:2;

[0023] Wherein, the dry powder preparation material includes the following components and corresponding weight percentages:

[0024] Aluminum oxide powder 55%, kaolin 15%, talcum powder 15%, calcium carbonate 15%

[0025] Described sodium silicate solution preparation material comprises silicate and deionized water that proportioning is 1:2;

[0026] The preparation steps of inorganic glue for high temperature are as follows:

[0027] A, take described dry ...

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Abstract

The invention discloses inorganic glue for high temperature conditions and a preparation method and application of the inorganic glue. The inorganic glue for the high temperature conditions is prepared from dry powder and a sodium silicate solution, wherein the dry powder comprises alumina powder, kaolin, talc powder and calcium carbonate, the alumina powder is dominant in a formula of the dry powder, the talc powder is made of irregular particles and used for increasing the adhesive area, and the kaolin is a common adhesion agent in everyday life and can enhance the viscosity of the glue. Thepreparation method comprises the steps of: performing ball milling and high-temperature calcination on the dry powder, removing molecular water after the high-temperature calcination, and then preparing the inorganic glue for high temperature conditions. According to the inorganic glue for high temperature conditions and the preparation method and application of the inorganic glue, the powder materials are combined tighter, and the inorganic glue for the high temperature conditions has much better water resistance than other inorganic glue, and can be used in higher temperature conditions.

Description

technical field [0001] The invention relates to an inorganic glue for high temperature, a preparation method and an application thereof. Background technique [0002] The so-called inorganic glue does not contain magnesium, phosphorus, aluminum, iron and other chemical components in the additives. It has good chemical activity, waterproof and moisture-proof, and a small amount of fixed carbon reduction. [0003] At present, the inorganic glues on the market have excellent effects in temperature resistance, but the viscosity is poor, and the inorganic glues will appear "moisture" after a period of use, causing the colloid to soften and fall off. Some formula raw materials selected by the existing inorganic glue generally have one or two kinds of raw materials with large particles and low mesh number, which is easy to cause the precipitation and stratification of large particles of glue, and the existence of large particles limits the glue How to use and smaller items can not...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/26C04B20/04C04B20/02
Inventor 柯建家赵杰
Owner XIAMEN GREEN WAY ELECTRONICS TECH
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