Baking device and baking method for cylindrical sputtering target material
A technology of sputtering target material and roasting device, which is applied in sputtering coating, metal material coating process, ion implantation coating and other directions, can solve the problems of uneven flow path of oxygen-containing gas and uneven temperature distribution, etc. The effect of stable roasting quality, sufficient heat resistance and long service life
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[0040] use figure 1 , 2 , 3, and 4 will describe the firing apparatus 1 (hereinafter referred to as firing apparatus 1 ) of a cylindrical sputtering target according to the present invention.
[0041] The cylindrical sputtering target M used in the firing apparatus and firing method of the cylindrical sputtering target of the present invention is a long cylindrical sputtering target with a diameter of 150 to 300 mm, a layer thickness of about 10 mm, and a length of 1.5 to 2 m. material. The material is ITO (tin oxide-indium oxide) material, AZO (aluminum oxide-zinc oxide) material or IGZO (indium oxide-gallium oxide-zinc oxide) material. Regarding the firing, in the case of ITO materials, at a high temperature of 1450 to 1700°C, preferably at a high temperature of 1500 to 1600°C, and in the case of AZO or IGZO materials, at a high temperature of 1250 to 1500°C, It is preferably carried out at a high temperature of 1300-1450°C in an oxygen atmosphere for 3-30 hours, preferab...
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