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A flexible circuit board and its laser preparation process

A technology of flexible circuit board and preparation process, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems such as the inability to meet the requirements of low line spacing circuit boards, and achieve the effect of reduced reliability, easy realization, and high precision

Active Publication Date: 2020-09-01
GUANGZHOU ANXUTE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The minimum pitch (the distance between the center points of two adjacent circuits) produced in the traditional subtractive process in the prior art is 60 μm, but most of the ones that can be mass-produced are 70 μm; the limit of the semi-additive process 40μm, most of which can be mass-produced are 50μm, but it still cannot meet the market's demand for low line spacing circuit boards

Method used

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  • A flexible circuit board and its laser preparation process
  • A flexible circuit board and its laser preparation process
  • A flexible circuit board and its laser preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] See Figure 1 to Figure 10 A single-sided flexible circuit board 1 of this embodiment includes an insulating layer 11, a circuit 12 buried in the insulating layer 11, a solder resist layer 13 on one side of the insulating layer 11, and a surface on the other side of the insulating layer 11 The protective layer 16 is provided with a plurality of pad areas 14 on the solder resist layer 13, and the pad areas 14 are connected and penetrated with the circuit 12. The upper surface of the circuit 12 in the pad area 14 has a surface treatment layer 15. The material of the solder resist layer 13 and the surface protection layer 16 is ink, and the surface treatment layer 15 is a metal plating layer. From top to bottom, there are a gold layer, a palladium layer and a nickel layer. The thickness is 0.05-0.15μm, 0.05-0.15μm, 3-8μm.

[0039] This embodiment also provides a manufacturing process of a flexible circuit board, such as figure 2 As shown, it specifically includes the follow...

Embodiment 2

[0060] The single-sided flexible circuit board 1 of this embodiment is basically the same as the first embodiment. The difference lies in: the laser parameters in the laser operation in the preparation method of the single-sided flexible circuit board 1 of this embodiment are: power 2.5W, The frequency is 100kHz, the speed is 400mm / s, and the number of etchings is 3 times.

Embodiment 3

[0062] The single-sided flexible circuit board 1 of this embodiment is basically the same as the first embodiment. The difference lies in: the laser parameters in the laser operation in the preparation method of the single-sided flexible circuit board 1 of this embodiment are: power 1.5W, The frequency is 50kHz, the speed is 200mm / s, and the number of etchings is 6 times.

[0063] The circuit in the flexible circuit board of the present invention is embedded in the insulating layer, and the width and line spacing of the circuit are further reduced under the premise of maintaining high reliability. The line spacing can reach as low as 20 μm, and the product size is also ultra-thin and bent Good performance and assembly, which can reduce the risk of short circuit in the client package. The preparation process of a flexible circuit board of the present invention uses a laser to open circuit grooves, which can form grooves with a width of less than 10 μm. The produced circuit has hig...

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Abstract

The invention discloses a laser preparation process of a flexible circuit board. The laser preparation process comprises the following steps of applying a dry film on a copper foil on one side after asubstrate is prepared, emitting a laser beam to form a laser hole after a copper foil at the other side is etched, preparing a circuit in the laser hole and then removing the dry film, then etching remaining copper foil, preparing a solder resist layer and a surface protection layer and reserving a pad area, and finally preparing a surface treatment layer on an upper surface of the circuit in thepad area. According to the laser preparation process of a flexible circuit board, the laser is used to make a circuit groove, the width and line pitch of the circuit are reduced further under the premise of maintaining high reliability, a groove with the width smaller than 10 um can be formed, the prepared circuit has the advantages of high fineness, low cost, high reliability, the method is easyto implement, and mass production can be achieved.

Description

Technical field [0001] The invention belongs to the technical field of printed circuits, and specifically relates to a flexible circuit board and a laser preparation process thereof. Background technique [0002] With the continuous advancement of science and technology, the consumer electronics industry such as mobile phones, Pads and other products are developing rapidly, and the demand for miniaturization and high resolution of the display is becoming more and more urgent, thereby improving the tightness of the circuit of the soft board package. Claim. The minimum pitch (the distance between the center points of two adjacent circuits) produced in the conventional subtractive process in the prior art is 60μm, but most of which can be mass-produced are mainly 70μm; the semi-additive process limit 40μm, most of which can be mass-produced are mainly 50μm, but it still can't meet the market demand for low pitch circuit boards. Summary of the invention [0003] In view of this, in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K3/02
CPCH05K3/02H05K3/40H05K2203/107
Inventor 邓明黄大兴李大树
Owner GUANGZHOU ANXUTE ELECTRONICS