Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Locking structure and mainboard component

A technology for locking structures and components, applied to digital data processing components, instruments, electrical digital data processing, etc., can solve the problem of difficult disassembly and assembly of the buckle, and achieve the effect of shortening the time

Active Publication Date: 2018-03-16
INVENTEC PUDONG TECH CORPOARTION +1
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention is to provide a locking structure and a main board assembly, so as to solve the problem that the buckle of the fixing slot fastener in the prior art is difficult to disassemble

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Locking structure and mainboard component
  • Locking structure and mainboard component
  • Locking structure and mainboard component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The detailed features and advantages of the present invention are described in detail below in the embodiments, which are sufficient to enable those skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the contents disclosed in this specification, claims and accompanying drawings , those skilled in the art can easily understand the related objects and advantages of the present invention. The following examples are to further describe the viewpoints of the present invention in detail, but not to limit the scope of the present invention in any way.

[0041] see Figure 1 to Figure 3 . figure 1 It is a perspective view of the combination of the motherboard assembly and the heat dissipation device disclosed according to the first embodiment of the present invention. figure 2 for figure 1 exploded view of the motherboard components. image 3 for figure 1 Cutaway view of the motherboard assembly. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a mainboard component. The mainboard component comprises a circuit board, an extended socket, multiple assembly board parts, a backboard and multiple locking structures. The circuit board is provided with a setting surface, a back surface and multiple penetration holes; the back surface is opposite to the setting surface; and the penetration holes run through the back surface from the setting surface. The extended socket is arranged on the setting surface of the circuit board. Each of the assembly board parts is provided with at least one through hole; the assembly board parts are abutted on the setting surface of the circuit board; and the through holes are connected with the penetration holes respectively. The backboard is provided with multiple lock holes; the backboard is abutted on the back surface of the circuit board; and the lock holes are connected with the penetration holes respectively. Each of the locking structures comprises a first screw stud, a pressing block and a second screw stud; and the two opposite sides of the pressing block are connected with the first screw stud and the second screw stud respectively. The first screw studs penetrate through the through holes and the penetration holes to be locked to the lock holes for enabling the pressing blocks to press the assembly board parts; and the second screw studs are used for assembly connection of a cooling apparatus. The invention furthermore discloses a locking structure.

Description

technical field [0001] The present invention relates to a locking structure and a mainboard assembly, in particular to a mainboard assembly with a locking structure having a pressing block. Background technique [0002] At present, the mainboard of electronic equipment is often provided with electronic component slots and multiple slot fasteners. The electronic component slot is used for insertion of an electronic component, such as a central processing unit and other electronic components that generate heat. Therefore, the main board is provided with a plurality of studs around the electronic component slots for assembling the heat sink to provide heat dissipation, and one end of the plurality of studs passes through the main board and is locked to a back plate to prevent the main board from bending. The slot fastener is arranged on the main board and leans against the electronic component slot to strengthen the strength of the electronic component slot fixed on the main b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18
CPCG06F1/183
Inventor 蔡惠民郭秀惠
Owner INVENTEC PUDONG TECH CORPOARTION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com