Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for analyzing impact of change and apparatus thereof

A technology of an analysis device and an analysis method, applied in the field of impact analysis and its device, can solve the problems of omission, system quality degradation, specifications not included in the results, etc.

Active Publication Date: 2018-03-27
HITACHI LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the influence and ripple analysis using the technology disclosed in the above-mentioned Patent Document 1, there are cases where the necessary conditions and specifications that have no influence are included in the result (misidentification), and the necessary conditions and specifications that are originally influential are not included in the result. Situation (omission)
After the impact and ripple analysis, it is time-consuming to study the specific impact content, so if there are many misidentifications, it will lead to a significant increase in development costs
In addition, omissions may result in omission of the reflection of the impact accompanying changes in requirements and specifications, which may lead to a significant decrease in system quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for analyzing impact of change and apparatus thereof
  • Method for analyzing impact of change and apparatus thereof
  • Method for analyzing impact of change and apparatus thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

[0042] The hardware structure of the impact analysis device 100 in this embodiment is as follows: figure 1 As shown, the function block is constituted as figure 2 shown below, while referring to the appropriate figure 1 and figure 2 , while describing this embodiment.

[0043] Such as figure 2 As shown, the influence and ripple analysis device 100 is equipped with: a traceability management function 201, which takes as input a trace condition 200 composed of design information that becomes the starting point of the influence and ripple analysis, and takes a set of related source design information and related destination design information as The tracking result 203 is output; the keyword search function 206 uses the keyword search condition 205 composed of keywords as an input to search design information, and outputs design information matching the condi...

Embodiment 2

[0089] use Figure 12 to Figure 16 A second embodiment of the present invention will be described.

[0090] The impact wave and analysis device 2100 of this embodiment (refer to figure 1 ) structure and described in embodiment 1 figure 1 Compared with the shown structure, since it is the same except CPU110, illustration is abbreviate|omitted. CPU2110 of this embodiment corresponding to CPU110 of Embodiment 1 (refer to figure 1 )implement Figure 12 function shown.

[0091] Figure 12 The functional structure of the impact analysis device 2100 of this embodiment having the keyword extraction function 2204, the influence score calculation function 2208, and the control function 1201 is shown.

[0092] The influence and ripple analysis device 2100 of this embodiment differs from the influence and ripple analysis device 100 described in Embodiment 1 without the control function 1201 in that it is different from figure 1 The CPU 2110 of the present embodiment corresponding t...

Embodiment approach

[0105] When a condition other than the origin design information can be specified in the traceability management function 2200 input in the traceability management function 2201, the condition can be generated in S1304. For example, there is an embodiment in which the number of keywords included in the tracking result 2203 is large in order to adjust the number of design information included in the impact analysis result 2209 when the depth of the tracking can be specified as a condition. Down to reduce the depth of the trace.

[0106] In addition, in S1304, when the number of design information included in the impact analysis result 2209 exceeds the threshold / less than the threshold, the starting point design information when the impact analysis result 2209 is obtained can be directly used, and other conditions are changed to repeat Perform impact and ripple analysis.

[0107] Figure 14 expressed in Figure 13 In the shown processing flow, it is an example of the processi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for analyzing an impact of change and an apparatus thereof. In order to realize a method for analyzing an impact of change with less misidentification and missing, an apparatus for analyzing an impact of change for investigating a change impact range caused by a change in requirements and specifications includes: a storage unit that stores design information and keywords; an input unit that inputs a trace condition including the design information representing an origin of a change impact analysis in design conditions stored in the storage unit and the keywordsstored in the storage unit; a CPU that receives the trace condition including the design information representing the origin of the change impact analysis and the keywords from the input unit, and calculates an influence score representing a probability of the influence caused by the change in the requirements and the specifications for each of the design information; and a display unit that outputs a result calculated by the CPU.

Description

technical field [0001] The present invention relates to a method and apparatus for analyzing the influence and influence, which are used to investigate the influence and influence caused by the change of the necessary conditions and specifications of the system development. Background technique [0002] When the requirements and specifications are changed during system development, an impact and ripple analysis is performed to investigate the requirements and specifications that need to be changed along with the changes. As a method of influence and ripple analysis, there are a method using traceability management and a method using keyword search. [0003] There is Japanese Unexamined Patent Application Publication No. 2014-232505 (Patent Document 1) as an apparatus that performs impact and ripple analysis using traceability management. In the abstract column of this patent document 1, it is described that "an inter-item association generation support device for inputting ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/30G06F17/50
CPCG06F16/3331G06F30/00G06F8/20G06F8/77G06F11/3636G06F16/24578
Inventor 高井康势河合克己神佑介土屋良介三部良太向坂太郎
Owner HITACHI LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com