Substrate processing apparatus and substrate transferring method

Abstract

The invention provides a substrate processing apparatus and a substrate transferring method. A substrate transferring method capable of accurately determining the respective positions of two substrates arranged in an overlapping manner is provided. In the substrate processing apparatus (10) in which two wafers (W) are held in an overlapping manner by a transfer arm (14a), a light emitting part (29a) of a lower wafer detection sensor (29) is configured in a region where the lower wafer (W) passes when the lower wafer (W) is transferred to the inside of a processing module (13) and is configuredto be located between the lower wafer (W) and the upper wafer (W), a light receiving part (29b) of the lower wafer detection sensor (29) is configured so as to face the light emitting part (29a) viathe lower wafer (W), and an upper wafer detection sensor (30) is configured in a region where the upper wafer (W) passes when the upper wafer (W) is transferred to the inside of the processing module(13).

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate transfer method for carrying two substrates into one processing chamber. Background technique [0002] Substrate processing in which a semiconductor wafer (hereinafter simply referred to as "wafer") as a substrate is subjected to a predetermined treatment, such as COR (Chemical Oxide Removal: Chemical Oxide Removal) treatment, PHT (Post Heat Treatment: Post Heat Treatment) treatment In the device, a plurality of processing modules as processing chambers are arranged near the transfer module as a common transfer chamber, and while one wafer is being transferred to one processing module, COR processing and PHT processing are performed on other wafers in other processing modules, Processing efficiency is thereby improved. In particular, COR processing and PHT processing are processes that require time, so each processing module accommodates two wafers, and performs COR proc...

AI Technical Summary

Problems solved by technology

Usually, a load module as an atmospheric transfer chamber connected to the transfer module is provided with a positioner as a position alignment device, and the position of the wafer is corrected in the positioner, but in this case, it is necessary to make the wafer transfer The reciprocating movement between the module and the loading module, so the processing efficiency is significantly reduced

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