Die cutting device for porous ultrathin single-sided adhesive tape

Abstract

The invention relates to a die cutting device for porous ultrathin single-sided adhesive tape. The die cutting device comprises a first die cutting unit and a second die cutting unit which are sequentially arranged in the moving direction of a single-sided adhesive tape material strap, and waste discharging adhesive tape is arranged on the lower surface of the single-sided adhesive tape material strap. The first die cutting unit comprises a circular knife die cutting mechanism and a first waste discharging mechanism which are sequentially arranged in the moving direction of the single-sided adhesive tape material strap, and the second die cutting unit comprises a flat knife die cutting mechanism and a second waste discharging mechanism which are sequentially arranged in the moving direction of the single-sided adhesive tape material strap. The single-sided adhesive tape material strap is perforated through the first die cutting unit and then subjected to punching forming in the seconddie cutting unit. Compared with the prior art, the die cutting device for the porous ultrathin single-sided adhesive tape is advantageous in that in the die cutting process of circular holes, a flat knife punching mode is changed into a circular knife punching mode, so that the broken filament phenomenon occurring during die cutting is effectively avoided, meanwhile, continuous and automatic wastedischarging is achieved, complicated steps of intermittent waste discharging at regular intervals are avoided, working efficiency is greatly improved, labor cost is lowered, the die cutting speed canbe changed, and product quality is good.

Description

technical field [0001] The invention belongs to the technical field of single-sided adhesive processing, and relates to a die-cutting device for porous ultra-thin single-sided adhesive. Background technique [0002] In the processing of single-sided adhesive tape, die-cutting process is often used. When die-cutting the single-sided adhesive, if the structure of the single-sided adhesive is more complicated, a multi-step die-cutting method will be used to process the single-sided adhesive into shape. For example, when there are many round holes on the single-sided adhesive product, a two-step punching process is generally used: (1) on the first punching die, punch the inside of the single-sided adhesive; (2) on the second punching die, Die-cut the outer contour of the single-sided adhesive to get the finished single-sided adhesive. [0003] In the existing punching process, the first punching die and the second punching die are both flat knife punching dies. If there are t...

AI Technical Summary

Problems solved by technology

If there are too many round holes on the single-sided adhesive product, during the first punching process, the flat knife punching die is easy to punch out hairs and stick to the die, and the die needs to be cleaned regularly, which increases the operation steps and workload; and The round hole scraps punched by the flat knife punching die are stored in the punching knife hole of the lower die of the flat knife punching die, and the waste needs to be cleaned manually on a regular basis. Since a lot of round hole scraps are punched out in one punching process, there is a single punch in the mold. The cleaning workload of surface glue waste will be greatly increased

In addition, in order to ensure the accuracy and stability of punching, the punching speed should not be too fast. If the single-sided adhesive product is too large, the flat-knife punching die can only punch one single-sided adhesive product at a time, which greatly reduces the cost. Productivity

Images