Substrate processing equipment

Abstract

The present invention relates to a substrate processing device, in particular to a substrate processing device which uses plasma to form a plurality of concavo-convex portions on the surface of a substrate. The present invention discloses a substrate processing device, which is characterized in that it comprises: a chamber body 110 with an upper opening, and an upper cover plate 120 combined with the chamber body 110 to form a closed processing space S; and a substrate support The part 130 is provided in the process chamber 100, applies a plurality of RF power sources, and supports the tray 20 on which a plurality of substrates 10 are placed; and the gas injection part 130 is provided in the upper side of the processing space S, so that the The gas for performing substrate processing; and the tray cover part 150, which is movable up and down in the process chamber 100, and forms a plurality of openings 152 by means of the gas injection part 140, in order to allow the injected gas to flow in; And the up and down moving part 200 moves the tray cover part 150 up and down to prevent interference when the tray 20 is loaded into or removed from the process chamber 100 .

Description

technical field [0001] The present invention relates to a substrate processing apparatus (Substrate processing apparatus), in particular to a substrate processing apparatus that uses plasma to form a plurality of concavo-convex portions on the surface of a substrate. Background technique [0002] The substrate processing device is a device composed of a vacuum chamber and a substrate support frame. The vacuum chamber forms a closed internal space. The substrate support frame is installed in the vacuum chamber to place the substrate. While injecting processing gas into the internal space, applying The power source thus etches or deposits the surface of the substrate. [0003] The substrates processed by the substrate processing apparatus include wafers for semiconductors, glass substrates for LCD panels, substrates for solar energy, and the like. [0004] As an example of the above-mentioned substrate processing apparatus, there is a substrate processing apparatus in which a...

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Problems solved by technology

[0009] However, the existing substrate processing apparatus transfers the protective component on the insulator tray, and when the RF power is applied, there is no electrical connection with other components in the chamber during the process, so that the protective component becomes energized in the process chamber. In the floating state, plasma is also formed in spaces other than the space between the protection parts and the tray, resulting in a problem of low process efficiency

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