Sealed devices and methods for making the same

Abstract

Disclosed herein are sealed devices comprising at least one cavity containing at least one quantum dot or at least one laser diode are also disclosed herein. The sealed devices can comprise a glass substrate sealed to an inorganic substrate, optionally via a sealing layer, the seal extending around the at least one cavity. Display and optical devices comprising such sealed devices are also disclosed herein, as well as methods for making such sealed devices.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority under 35 U.S.C. §119 to: U.S. Provisional Application Serial No. 62 / 249691, filed November 2, 2015; U.S. Provisional Application Serial No. 62 / 214548, filed September 4, 2015 Provisional Application and U.S. Provisional Application Serial No. 62 / 204122, filed August 12, 2015, the respective contents of which are the basis of this document and are hereby incorporated by reference in their entirety. technical field [0003] The present disclosure relates generally to sealed devices, and more particularly to sealed devices including quantum dots, laser diodes, light emitting diodes, or other light emitting structures, and display devices and optical devices including such sealed components. Background technique [0004] Hermetically sealed glass packages and enclosures are becoming increasingly popular for electronic and other device applications that can benefit from an enc...

AI Technical Summary

Problems solved by technology

Such a high temperature sealing process can be detrimental to temperature sensitive workpieces

Additionally, negative CTE inorganic fillers in frit pastes can adversely affect the clarity of the frit, resulting in opaque seals

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