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Photoresist coating system and method

A coating method and technology of photoresist, applied in the direction of surface coating liquid device, coating, photoplate making process coating equipment, etc., can solve the problems of photoresist coating waste, etc., to reduce the amount of use, Reduced time, effect of reduced photoresist volume

Inactive Publication Date: 2018-04-20
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of photoresist coating system method, to solve the problem that the coating waste of photoresist is bigger in the prior art

Method used

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  • Photoresist coating system and method

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Experimental program
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Effect test

Embodiment 1

[0031] according to figure 2 To further illustrate, the present invention provides a photoresist coating system. The photoresist coating system 100 includes: a wafer carrier 110, a driving device 120, a photoresist storage device 130, and a photoresist nozzle 140; The driving device 120 is connected to the wafer carrier 110 to drive the wafer carrier 110 to rotate; the photoresist nozzle 140 is located above the wafer carrier 110, and the photoresist nozzle 140 The number is multiple, and each photoresist shower head 140 is movably connected with the photoresist storage device 130 . In the embodiment of the present application, the number of the photoresist nozzles 140 is three.

[0032] In this embodiment, the wafer carrier 110 is circular.

[0033] In this embodiment, the wafer carrier 110 vacuum absorbs the wafer 300 . The center position of the wafer 300 corresponds to the center position of the wafer carrier 110 , and the radius of the adsorption area of ​​the wafer 3...

Embodiment 2

[0045] according to Figure 5 , Figure 7 and Figure 7 To further illustrate, compared with Embodiment 1, the photoresist nozzle 240 in Embodiment 2 is distributed above the wafer 300 along the diameter of the wafer 300, and there is a photoresist nozzle 240 above the wafer center 310. The process of spraying photoresist Among them, the photoresist nozzles 240 are sprayed at the same time. In this embodiment, the photoresist nozzles 240 are five, and the photoresist nozzles 240 are sprayed at the same time. The amount of circle 300, finally reduces the amount of photoresist used. During the photoresist spraying process, the rotary motor 220 drives the wafer carrier 210 to rotate, so that the wafer 300 rotates at the first rotational speed, and the rotational speed must be lower than 3000 rpm; after the photoresist nozzle 240 is sprayed, the rotary motor 220 Drive the wafer carrier 210 to rotate, so that the wafer 300 rotates at the second rotation speed, and the rotation s...

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PUM

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Abstract

The invention provides a photoresist coating system and method. The photoresist coating system comprises a wafer bearing table, a drive device, a photoresist storage device and photoresist sprayers. The drive device is connected with the wafer bearing table so as to drive the wafer bearing table to rotate. The photoresist sprayers are located above the wafer bearing table. The multiple photoresistsprayers are arranged, and each photoresist sprayer is movably connected with the photoresist storage device. The photoresist sprayers are located above the wafer bearing table. The multiple photoresist sprayers are arranged, each photoresist sprayer is movably connected with the photoresist storage device, accordingly, the positions of the photoresist sprayers can be set according to the size ofwafers and photoresist uniformity, accordingly, the photoresist sprayers better adapt to wafer coating, accordingly, the photoresist coating time can be shortened, the amount of photoresist thrown out of the wafers is reduced, finally, the photoresist usage amount is reduced, and bad photoresist coating is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a photoresist coating system and method. Background technique [0002] In the semiconductor manufacturing process, the photolithography process has always been considered as a key step in the manufacture of integrated circuits. Wafer coating is very important in the entire photolithography process. Its stability and reliability have an impact on product quality, yield and cost. important influence. The photolithography process is a complex process, the essence of which is to copy the circuit structure in the form of a pattern on the wafer to be etched and ion-implanted in the future. First, the photoresist coating system is used to form a photoresist on the wafer. Then the parallel light is irradiated on the thin layer of photoresist through the mask to make it exposed and deteriorated, and finally the developing solution is used for development to complete the pattern tr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B13/02B05B12/08B05D1/02G03F7/16
CPCB05B13/0228B05B12/084B05B13/0278B05D1/02G03F7/16
Inventor 朱治国
Owner SHANGHAI HUALI MICROELECTRONICS CORP