Sealing device for measuring mechanical property of small-sized test specimen by bubbling method

Abstract

The invention discloses a sealing device for measuring the mechanical property of a small-sized test specimen by a bubbling method. The sealing device comprises an inside hexagonal bolt A (101a), an inside hexagonal bolt B (101b), an inside hexagonal bolt C (101c), an inside hexagonal bolt D (101d), a fixing plate (102), a test specimen (103), an acrylic plate (104), a sealing silica gel ring (105), a base (106) and a hydraulic pipe (107). Through the device, phenomena of liquid leakage and pressure leakage are enabled not to occur in the bubbling experiment process; the sealing device belongsto the technical field of small-sized test specimen mechanical property experiment. The sealing device has the advantages that by aiming at the small-sized test specimen, the phenomena of liquid leakage and pressure leakage are enabled not to occur in the bubbling experiment process; the device structure is simple; the operation is convenient.

Description

technical field [0001] The invention relates to a sealing device for measuring the mechanical properties of small-sized samples by bubbling method. The device ensures that there will be no liquid leakage and pressure relief during the bubbling test, and belongs to the technical field of small-sized sample mechanical properties experiments . Background technique [0002] At present, according to the principle of the bubbling method, the bubbling method refers to an experimental method in which pressure is applied to one side of the film suspended above it through the small holes of the substrate, so that the film will bulge under the action of pressure until it is peeled off. For electronic packaging materials, the size of the material is very small, reaching several microns. In common bubbling devices, the sample size is often too small to ensure the sealing of the device. Therefore, it is imminent to design a sealing device for the mechanical properties of small-sized samp...

AI Technical Summary

Problems solved by technology

[0002] At present, according to the principle of the bubbling method, the bubbling method refers to an experimental method in which pressure is applied to one side of the film suspended above it through the small holes of the substrate, so that the film will bulge under the action of pressure until it is peeled off. For electronic packaging materials, the size of the material is very small, reaching a few microns. In common bubbling devices, the sample size is often too small to ensure the sealing of the device.

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