Three-dimensional fan-out type packaging structure and manufacturing method thereof

Abstract

The embodiment of the present invention discloses a three-dimensional fan-out type packaging structure. The three-dimensional fan-out type packaging structure comprises a first chip, a second chip, awiring structure, first metal columns and second metal columns, the front surface of the first chip comprises electrodes, the surfaces of the electrodes are provided with conductive poles, the front surface of the second chip comprises electrodes, a backside layer of the second chip is attached to the backside of the first chip, the wiring structure comprises first insulation resin and a conductorline embedded in the first insulation resin, the wiring structure comprises a first surface and a second surface opposite to the first surface, the first metal columns and the second metal columns form the first surface on the wiring structure and are electrically connected with the conductive line, the first chip is welded on the first metal columns in an inverted manner, the first metal columnsare electrically connected with the conductive poles, and the second metal columns are electrically connected with the electrodes of the second chip through bonding lead wires.

Description

technical field [0001] The invention relates to the packaging field, in particular to a three-dimensional high-density fan-out packaging structure and a manufacturing method thereof. Background technique [0002] Three-dimensional integrated circuit packaging has many advantages, such as high packaging density and small footprint. There are various three-dimensional integrated circuit packaging structures and three-dimensional integrated circuit packaging methods in the prior art. [0003] figure 1 A schematic cross-sectional view of a prior art PoP (package on package) package structure is shown. The PoP package is fabricated by stacking two packages, including a top package 101 and a bottom package 102 , with a total thickness of approximately 1.4 mm. Top package 101 contains stacked die 103 . The top package 101 and the bottom package 102 each contain a circuit board (circuit board thickness 0.3 mm) and a set of solder balls 104 (solder ball height 0.25 mm). This PoP...

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Problems solved by technology

[0010] Most of these three-dimensional integrated circuit packaging structures and methods based on the prior art need to use PCB circuit boards, adapter boards and TSV through holes, which have high manufacturing costs, complicated processes, and high packaging thickness.

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