Method of packaging semiconductor device
A packaging method and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of high production costs
Active Publication Date: 2018-04-27
DELTA ELECTRONICS INTL SINGAPORE
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Problems solved by technology
[0007] The purpose of the present disclosure is to provide a semiconductor device packaging method to solve the problem of high production cost of the traditional embedded packaging structure
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[0036] Some typical embodiments embodying the features and advantages of the present disclosure will be described in detail in the description in the following paragraphs. It should be understood that the present disclosure is capable of various changes in different embodiments without departing from the scope of the present disclosure, and that the description and illustrations therein are considered to be illustrative in nature, not framed to limit this disclosure.
[0037] The packaging method of the present disclosure can actually package one electronic component or multiple electronic components, and the following will exemplarily illustrate the packaging method of the present disclosure for one electronic component. Figure 1A to Figure 1N It is a structural flow chart showing a packaging method of an electronic component according to a preferred embodiment of the present disclosure, figure 2 In order to use the packaging method of the electronic component of the prefer...
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A method of packaging a semiconductor device is provided. A first insulation layer comprising stacked prepreg layers is provided, and a metallic protective layer is formed on the first insulation layer. A first alignment mark is formed on the first insulation layer, and an accommodation cavity is formed in the first insulation layer according to the first alignment mark. A second alignment mark isformed on the first insulation layer according to the first alignment mark. A carrier plate is attached on the first insulation layer through a thermal release tape layer, and the semiconductor device is temporarily fixed on the thermal release tape layer within the accommodation cavity according to the second alignment mark. A second insulation layer is placed over the first insulation layer, and the second insulation layer is laminated and cured. The carreri plate and the thermal release tape layer are removed. A re-distribution layer is formed on the second insulation layer, and the re-distribution layer is electrically connected with the semiconductor device.
Description
technical field [0001] The present disclosure relates to a packaging method, in particular to a packaging method of electronic components. Background technique [0002] In recent years, the design of electronic devices tends to be small in size, thin and light, and easy to carry. Furthermore, with the advancement of electronic industry technology, the internal circuits of electronic devices have gradually developed towards modularization. In other words, multiple electronic components are integrated into a single electronic module. For example, a power module is one of widely used electronic modules, and the power module may include, for example but not limited to, a DC to DC converter, a DC to AC converter Or AC - DC converter (AC to DC converter). After a plurality of electronic components (such as capacitors, resistors, inductors, transformers, diodes, and transistors) are integrated into a power module, the power module can be installed on a main board or a system circ...
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IPC IPC(8): H01L21/60
CPCH01L24/24H01L24/82H01L2224/2402H01L2224/82H01L21/568H01L24/19H01L2224/04105H01L2224/73267H01L2223/54426H01L2224/82039H01L2224/96H01L2924/13055H01L2924/13064H01L2924/13091H01L2924/14H01L2924/351H01L2924/3511H01L23/3121H01L21/561H01L23/544H01L2223/54486H01L21/486H01L23/5384H01L23/5389H01L21/6836H01L21/4857H01L21/4864H01L23/5383H01L23/5386
Inventor 许晓凤林平平黎耀威
Owner DELTA ELECTRONICS INTL SINGAPORE