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Preparation method of PCB with step groove

A step groove and groove bottom technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problem of increasing the assembly volume of printed circuit boards, and achieve the effect of fully utilizing and reducing assembly volume

Inactive Publication Date: 2018-05-08
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the stepped grooves of printed circuit boards are first-order metallized or non-metallized stepped grooves with large dimensions.
This single-size stepped slot design can only be used to assemble a single component. For additional components that need to be assembled, such as small chips or power amplifiers, they need to be mounted on the surface of the printed circuit board, thereby increasing the cost. Assembly volume of printed circuit board

Method used

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  • Preparation method of PCB with step groove
  • Preparation method of PCB with step groove
  • Preparation method of PCB with step groove

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Embodiment Construction

[0032] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0033] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0034] Such as figure 1 Shown, the present invention provides a kind of preparation method that is provided with the PCB of stepped groove, and it comprises and following steps:

[0035] Step 1, providing a bottom substrate, and making circuit patterns on the bottom substrate.

[0036] Specifically, the bottom substrate includes at least o...

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Abstract

The invention belongs to the technical field of preparation of printed circuit boards and discloses a preparation method of a PCB with a step groove. The method comprises the following steps of (A) providing a bottom substrate and fabricating a circuit pattern on the bottom substrate; (B) providing a to-be-laminated substrate, embedding a glue stop block into one side, toward the bottom substrate,of the to-be-laminated substrate, and laminating and molding the to-be-laminated substrate and the bottom substrate which are superimposed from top to bottom into a multi-layer board; (C) forming a groove corresponding to the glue stop block in the other side, opposite to the bottom substrate, of the multi-layer board, taking out the glue stop block from the groove and obtaining a first groove with a nonmetallic side wall; and (D) forming a second groove of which the cross section area is smaller than that of the first groove in the bottom of the first groove to obtain the PCB with the step groove. According to the preparation method, through the arrangement of the glue stop block before laminating and molding, the first groove can be accurately formed in a circuit pattern region betweenthe to-be-laminated substrate and the bottom substrate; and through the arrangement of the second groove, the space of the step groove is more fully utilized.

Description

technical field [0001] The invention relates to the technical field of printed circuit board preparation, in particular to a method for preparing a PCB provided with stepped grooves. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, as a support for electronic components, it is an important electronic component. [0003] In order to reduce the assembly volume of the printed circuit board, or to assemble components that need to be sunken, step grooves are usually provided on the printed circuit board in existing designs. However, at present, the stepped grooves of the printed circuit board are the first-order metallized or non-metallized stepped grooves with relatively large dimensions. This single-size stepped slot design can only be used to assemble a single component. For additional components that need to be assembled, such as small chips or power amplifiers, they need to be mounted on the surface of the printed circuit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4697H05K2201/09845
Inventor 王洪府纪成光赵刚俊王小平
Owner DONGGUAN SHENGYI ELECTRONICS
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