Circuit module structure

Abstract

The invention discloses a circuit module structure, which comprises at least one first circuit module, wherein the first circuit module is provided with a first circuit board, a first bridging base and a second bridging base; the first circuit board is provided with a first substrate, a first female conductor and a first male conductor, the first female conductor and the first male conductor are arranged on the first substrate; the first bridging base is integrally manufactured, the bottom side of the first bridging base is provided with a first accommodating groove and two first embedding grooves, and the outer side of the first bridging base is provided with a first outer groove; the second bridging base is integrally manufactured, the bottom side of the second bridging base is providedwith a second accommodating groove and two embedding grooves, and the outer side of the second bridging base is provided with a second outer column; the first circuit board is embedded in the first embedding grooves and the second embedding grooves, the first female conductor is located in the first accommodating groove, and the first male conductor is located in the second accommodating groove. Therefore, the circuit module structure can achieve the purposes of being small in number of required components, reducing the cost, being simple to assemble and maintaining the good electrical conductivity.

Description

technical field [0001] The invention relates to a circuit module, in particular to a circuit module structure capable of three-dimensional stacking in multiple forms. Background technique [0002] When the existing circuit modules are to be connected, magnets are mainly provided on the end faces of the circuit modules so as to be connected in series by magnets attracting each other, such as US2013 / 0343025A1. However, not only is there a problem of easy detachment due to the limited attractive force of the magnet, but also because this kind of circuit module cannot be stacked up and down and connected sideways, resulting in less variability. [0003] Therefore, in order to overcome the above problems, the inventor of this case has invented a circuit module system, such as the Chinese patent CN204927641U (the US corresponding publication number US2016 / 0192492A1), which mainly constitutes a circuit module with a circuit board and a connecting seat. a seat and a conductor, the ...

AI Technical Summary

Problems solved by technology

[0004] However, since the conductors of this type of circuit module are embedded on the base body, and the base body is formed by connecting two shells in parallel, there are many components required as a whole, which leads to the problem of high manufacturing cost. It will lead to an increase in the number of steps in the assembly, and the assembly is troublesome

In addition, since the conductor must first be embedded on the base, and then the base is combined with the circuit board, the base will move relative to the circuit board during use and assembly, so that the contact between the conductor and the circuit of the circuit board is easily affected by the base. Affected by the mutual movement with the circuit board, the conductivity is not good, or there is a problem of easy wear

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