Circuit board air-cooled heat radiation device

A heat dissipation device and circuit board technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of large installation space of the adjustment device, unsuitable places with compact structures, and small ventilation volume. , to improve the heat dissipation effect, simplify the heat dissipation layout, and facilitate the effect of centralized air cooling

Active Publication Date: 2018-05-11
无锡巨日装备科技有限公司
View PDF12 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the device is not practical, and the adjustment device requires a large installation space, which is not suitable for places with compact structures, and the filter screen will accumulate dust after a period of use, resulting in reduced ventilation and poor heat dissipation, resulting in electronic components The operation is unstable, and it cannot prevent dust from entering the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board air-cooled heat radiation device
  • Circuit board air-cooled heat radiation device
  • Circuit board air-cooled heat radiation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Such as figure 1 , figure 2 , image 3 and Figure 4 As shown, the circuit board air-cooled heat dissipation device includes a chassis 11, a fan 19 and a heat conducting plate 2.

[0041] A slot 15 is provided in the chassis 11, and both sides of the circuit board 12 are inserted into the slot 15; there are no less than two circuit boards 12, and multiple circuit boards 12 are vertically arranged side by side. One end of the cabinet 11 is provided with a cooling chamber 16, and a partition 14 is arranged between the cabinet 11 and the cooling chamber 16. The partition 14 is provided with cooling holes and jacks, and the cooling holes and the jacks all connect the cabinet 11 with the cooling chamber 16. , The cooling chamber 16 is also provided with an air inlet 18 and an air outlet 17, and the fan 19 is installed on the air outlet 17.

[0042] The circuit board 12 is equipped with a heat conduction plate 2, the heat conduction plate 2 includes a heat conduction are...

Embodiment 2

[0048] Such as figure 1 , figure 2 , Figure 5 and Figure 6 As shown, the circuit board air-cooled heat dissipation device includes a chassis 11, a fan 19 and a heat conducting plate 2.

[0049] A slot 15 is provided in the chassis 11, and both sides of the circuit board 12 are inserted into the slot 15; there are no less than two circuit boards 12, and multiple circuit boards 12 are vertically arranged side by side. One end of the cabinet 11 is provided with a cooling chamber 16, and a partition 14 is arranged between the cabinet 11 and the cooling chamber 16. The partition 14 is provided with cooling holes and jacks, and the cooling holes and the jacks all connect the cabinet 11 with the cooling chamber 16. , The cooling chamber 16 is also provided with an air inlet 18 and an air outlet 17, and the fan 19 is installed on the air outlet 17.

[0050] The circuit board 12 is equipped with a heat conduction plate 2, the heat conduction plate 2 includes a heat conduction ar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a heat radiation device and especially relates to a circuit board air-cooled heat radiation device. The circuit board air-cooled heat radiation device comprises a cabinet, fans and heat-conducting plates. The cabinet is internally provided with circuit boards. One end of the cabinet is provided with a heat radiation chamber. A separator plate is arranged between the cabinet and the heat radiation chamber. The separator plate is provided with heat radiation holes and insert holes, wherein the heat radiation holes and the insert holes enable the cabinet and the heat radiation chamber to be communicated. The heat radiation chamber is provided with air inlets and air outlets. The fans are arranged in the air outlets respectively. Each heat-conducting plate comprises aheat-conducting area and a radiating area. The heat-conducting area and the radiating area are in an overall structure. The heat-conducting areas are fixedly arranged on the circuit boards and make contact with high-power heat radiation components; the radiating areas are arranged at the outer sides of the circuit boards, and are away from the circuit boards; and the radiating areas pass through the insert holes and are arranged in the heat radiation chamber. By prolonging the heat-conducting plates to form independent heat radiation channels, the device helps to realize centralized air cooling; the cabinet is compact in structure and can install more circuit boards under the condition of same size; and the device is better in heat radiation effect and is not easy to accumulate dusts.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a circuit board air-cooled heat dissipation device. Background technique [0002] With the advancement of production technology, the volume of the control box of some CNC equipment is getting smaller and smaller, and it is developing towards thinner and lighter. Due to the shrinking space and limited installation space, the heat generated by the components accumulates and is difficult to dissipate, which is likely to cause local overheating and damage. Ventilation and cooling are required, but the dust in the airflow is likely to have a negative impact on the components and cause the heat dissipation effect to deteriorate. [0003] For example, Chinese patent CN105960154A discloses a circuit board air-cooling adjustment device, including a fan and a fixing seat, the fixing seat is arranged above the fan, and a through hole is arranged in the fixing seat, and a through hole is arranged...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/205
Inventor 丁雪峰韦荣杰
Owner 无锡巨日装备科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap