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Electronic circuit module and method for testing electronic circuit module

A technology of electronic circuits and test methods, applied in circuits, multilayer circuit manufacturing, printed circuit components, etc., can solve problems such as increasing the area of ​​multi-layer substrates, and achieve the effect of easy pre-operation and easy analysis of defects

Inactive Publication Date: 2018-05-11
ALPS ALPINE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since a plurality of electrodes for testing must be arranged on the lowermost layer of the multilayer substrate in addition to a plurality of land electrodes required for the operation of the electronic circuit module, the area of ​​the multilayer substrate has to be increased. Leads to upsizing of electronic circuit modules

Method used

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  • Electronic circuit module and method for testing electronic circuit module
  • Electronic circuit module and method for testing electronic circuit module
  • Electronic circuit module and method for testing electronic circuit module

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Embodiment approach

[0047] First, refer to Figure 1 to Figure 5 , the structure of the electronic circuit module 100 according to the embodiment of the present invention will be described. figure 1 is a perspective view showing the appearance of the electronic circuit module 100, figure 2 is a plan view of the electronic circuit module 100 viewed from above, image 3 It is a top view of the electronic circuit module 100 seen from below. also, Figure 4 From figure 2 A cross-sectional view of the electronic circuit module 100 viewed along the line A-A shown, Figure 5 is a partially enlarged schematic view of the electronic circuit module 100 . in addition, Figure 5 The state before resin sealing of the electronic component 31 is shown.

[0048] Such as figure 1 as well as figure 2 As shown, the electronic circuit module 100 includes a rectangular multilayer substrate 10 and a plurality of electronic components 31 mounted on the uppermost layer 10 a of the multilayer substrate 10 ....

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Abstract

To provide an electronic circuit module that has test electrodes in the inner layer of a multilayer substrate and that enables a reduction in size, and a method for testing an electronic circuit module in which preliminary work for performing a failure analysis is facilitated. An electronic circuit module (100) provided with a multilayer substrate (10) and a plurality of electronic components (31)mounted on the uppermost layer (10a) of the multilayer substrate (10), wherein a plurality of land electrodes (11) necessary for normal operation are provided on the lowermost layer (10b) of the multilayer substrate (10), test electrodes (13) connected to the electronic components (31) are provided in the inner layer (10c) of the multilayer substrate (10), the test electrodes (13) and the land electrodes (11) are not connected, and the test electrodes (13) are provided at positions overlapping the land electrodes (11) in plan view.

Description

technical field [0001] The present invention relates to an electronic circuit module, in particular to an electronic circuit module provided with testing electrodes and a testing method for the electronic circuit module. Background technique [0002] In recent years, an electronic circuit module provided with electrodes for testing has been developed. The test electrodes are provided to identify electronic components that cause failures during failure analysis. For example, when an electronic component is covered with a sealing resin, since test probes cannot be directly brought into contact with the electronic component, on the lowest layer of the multilayer substrate on which the electronic component is mounted, a circuit board connected to the electronic component through a via hole is provided. A test probe is brought into contact with a plurality of test electrodes, and conduction or the like is checked. [0003] However, since a plurality of electrodes for testing mu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H01L23/12H01L25/00H05K1/11
CPCH01L25/00H05K1/11H05K3/46H01L22/30H01L2924/181H01L23/5384H01L23/5383H01L23/12H01L2924/00012H01L24/00H01L25/50
Inventor 丸山孝司须田茂宫崎正己井口大辅
Owner ALPS ALPINE CO LTD
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