A device for encapsulating a confinement ring of a sensor module and a method of using the same

Abstract

The present invention relates to the field of sensor production equipment, in particular to a packaging equipment for sensor module confinement rings and a method of use thereof. The packaging equipment includes a support base, and a coordinate positioning mechanism is arranged on the support base. The coordinate positioning mechanism A clamping mechanism for clamping the restraint ring is provided on the top, a feeding device for feeding is provided on the support base; a holding device for holding glue is provided on the support base and a Placement tray for placing circuit boards. Through the integration of traditional equipment, the invention makes the installation of the restraint ring more automatic, and changes the trouble of traditional manual adhesion. The invention can replace manual specific operations, realize mechanized production, monitor the force and displacement in real time, and effectively ensure the installation of the restraint ring Accuracy, at the same time, it has the function of automatic glue compensation, which replaces the traditional glue dispensing method, and more effectively controls the bonding process of the constraint circle.

Description

technical field [0001] The invention relates to the field of sensor production equipment, in particular to a sensor module constraint ring packaging equipment and a use method thereof. Background technique [0002] In the implementation of MEMS bare chip packaging process, the chip will be protected by a confinement ring after D / B and W / B. The traditional pasting process is realized manually or semi-automatically. The production efficiency is low, the consistency of processing accuracy cannot be guaranteed, and the amount of glue It cannot be effectively controlled, which in turn will lead to quality problems in the product pasting process and affect the service life of the sensor; so a device that can automatically stick the restraint ring is needed now. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the prior art, and to provide an automatic packaging device for bonding the constraint ring. [0004] In order to...

AI Technical Summary

Problems solved by technology

[0002] In the implementation of MEMS bare chip packaging process, the chip will be protected by a confinement ring after D / B and W / B. The traditional pasting process is realized manually or semi-automatically. The production efficiency is low, the consistency of processing accuracy cannot be guaranteed, and the amount of glue It cannot be effectively controlled, which will lead to quality problems during the product pasting process and affect the service life of the sensor; so a device that can automatically stick the restraint ring is needed now

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