Ball planting machine guide plate

Abstract

The invention discloses a ball mounter guide plate, and the guide plate comprises a plate body, a plurality of guide trenches, and a plurality of ball holes. The guide trenches are disposed at the topof the plate body, and are arranged at intervals. The ball holes are disposed at the bottoms of the guide trenches, and pass through the plate body. Each guide trench is connected with the ball holes. When a plurality of to-be-packaged conductive balls are disposed on the guide plate, the to-be-packaged conductive balls are gathered in the guide trenches under the gathering effect of the guide trenches. The to-be-packaged conductive balls can slide along the guide trenches till the to-be-packaged conductive balls enter the ball holes in the guide trenches, thereby improving the probability that the conductive balls fall into the ball holes. A ball shortage problem can be solved in the printing-type ball mounting technology, and a problem that a sucking disc does not suck a ball in the clamping and placing ball mounting technology is solved.

Description

Technical field [0001] The invention relates to a guide plate for a ball planter, in particular to a guide plate for a ball planter with guiding grooves. Background technique [0002] Existing semiconductor packaging is in response to the miniaturization of electronic devices, and the pins of the packaging need to be finer to be packaged on the gradually shrinking area of ​​the electronic device. The industry has produced the current ball grid array (BGA) technology of semiconductor packaging. , BGA technology is to cover the surface of the pins to be packaged with multiple conductive balls in a grid-like arrangement and fix these conductive balls. These conductive balls replace the needle-shaped pins, which not only reduces the need for pins. Miniaturization of electronic devices is realized by area, and the length of pins is reduced to provide faster electrical characteristics. [0003] The existing methods of manufacturing BGA conductive ball pins mainly use solder paste printi...

AI Technical Summary

Problems solved by technology

[0008] The main purpose of the present invention is to provide a ball planting machine guide plate to improve the problem of lack of balls in the holes of the mask in the printing ball planting technology, and to improve the problem that the suction cup of the ball planting technology of the holding and placing ball planting technology fails to suck the conductive balls

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