Backplane and method of forming the same
A backplane and bottom plate technology, applied in the field of target preparation, can solve the problems of shortening the service life of the backplane, deformation, cracking of the welding seam between the cover plate and the bottom plate, etc., and achieve the effect of improving performance
Active Publication Date: 2020-02-04
KONFOONG MATERIALS INTERNATIONAL CO LTD
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Problems solved by technology
[0004] However, since the backplane is in use, the cooling water will exert pressure on the backplane and the cover, thus deforming the cover or bottom, resulting in cracking of the weld between the cover and bottom, thereby shortening the service life of the backplane , therefore, the service life of the backplane formed by the prior art is relatively short
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[0035] As mentioned in the background art, there are many problems in the backplane, for example, the service life of the backplane is short.
[0036] Combining with a backplane, analyze the reasons for the short service life of the backplane:
[0037] The back plate includes: a bottom plate, the bottom plate includes a first welding surface, and there is a water tank in the bottom plate, and the first welding surface exposes the water tank; a cover plate, the cover plate includes a second welding surface; Solder between the first soldering surface and the second soldering surface.
[0038] Wherein, the material of the cover plate and the bottom plate is copper or aluminum. Since the copper material is expensive, it is easy to increase the production cost. Aluminum material has low cost and wide application. However, the hardness of aluminum is relatively low. During the use of the back plate, cooling water is passed into the water tank. The bottom plate and the cover plate...
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Abstract
The invention provides a back plate and a forming method thereof. According to the method, a bottom plate, a cover plate and an initial welding flux are provided. The bottom plate comprises a first welding face. A water tank is arranged in the bottom plate. The first welding face is exposed out of the water tank. The cover plate comprises a second welding face. One of the bottom plate and the cover plate is made of stainless steel, or both the bottom plate and the cover plate are made of stainless steel. Laminating treatment is carried out on the bottom plate, the cover plate and the initial welding flux, and the initial welding flux is located between the first welding face and the second welding face and makes contact with the first welding face and the second welding face, so that an initial back plate is formed. The initial back plate is welded, so that the initial welding flux forms welding flux. The stainless steel has high hardness and does not bend easily after water is introduced into the water tank, thus, a welding seam between the bottom plate and the cover plate does not crack easily, and then the service life of the back plate can be prolonged.
Description
technical field [0001] The invention relates to the field of target material preparation, in particular to a back plate and a forming method thereof. Background technique [0002] The target refers to the sputtering source that forms various functional thin films by sputtering coating method. Simply put, the target is the target material bombarded by high-speed energetic particles. In order to ensure that the target has good electrical and thermal conductivity, the target needs to be welded to the back plate (copper or aluminum, etc.) before sputtering to form a target assembly. The target is installed on the machine table through the back plate. [0003] During the vacuum sputtering process, the environment of the target assembly is very harsh. Its temperature is relatively high (such as 300 ℃ ~ 500 ℃), the target component is in a high-voltage electric field and a strong magnetic field, and the front is at 10 -9 In the high-vacuum environment of Pa, it is bombarded by ...
Claims
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IPC IPC(8): C23C14/34B23K31/02
CPCB23K31/02C23C14/3407
Inventor 姚力军潘杰相原俊夫王学泽吴东青
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD