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A kind of high modulus and high temperature resistant bismaleimide resin composition

A technology of bismaleimide resin and bismaleimide, applied in the field of high modulus and high temperature resistant bismaleimide resin composition, can solve the problem of high processing temperature, high molding cost and high energy consumption etc. to achieve the effects of improving compressive strength, solving high curing temperature, ensuring heat resistance and manufacturability

Active Publication Date: 2020-01-14
HENGSHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention proposes a high-modulus high-temperature-resistant bismaleimide resin composition to solve the problems of high post-treatment temperature, high energy consumption and high molding cost of existing bismaleimide resins. 200°C, without post-curing treatment, the glass transition temperature of the glass fiber composite material can reach 370°C; in addition, the tensile modulus of the cast body can reach 5.3GPa, which improves the compressive strength of the composite material, and is suitable for use in torpedoes and seabeds. Provides a new material choice for applications requiring high modulus resins, such as oil pipelines

Method used

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  • A kind of high modulus and high temperature resistant bismaleimide resin composition
  • A kind of high modulus and high temperature resistant bismaleimide resin composition

Examples

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Effect test

Embodiment 1

[0027] The invention is a high-modulus high-temperature-resistant bismaleimide resin composition, which consists of 50 parts by mass of bismaleimide monomer, 5 parts of cyano resin, and 15 parts of vinylaniline , 30 parts of allyl compounds, 0.5 parts of ketoxime accelerator, 0.1 part of imidazole accelerator, the bismaleimide monomer selected for the above bismaleimide resin composition is N, N'-(4,4'-methylenediphenyl)bismaleimide (MDA-BMI), N,N'-(4-methyl-1,3-phenylene)-bismaleimide The combination of two components of imide (TDA-BMI) according to the mass ratio of 2:1; the cyano resin is polyphthalonitrile resin; the vinyl aniline is 3-vinyl aniline; the allyl compound is di Allyl bisphenol A; the oxime accelerator is dimethylglyoxime; the imidazole accelerator is aminoimidazole.

[0028] attached figure 1 It is the DSC curve of the obtained bismaleimide resin composition according to the scanning speed of 10° C. / min. It can be seen from the curve that the curing peak t...

Embodiment 2

[0034] The difference between this example and Example 1 is that the selected bismaleimide monomer is N,N'-(4-methyl-1,3-phenylene)-bismaleimide imine (TDA-BMI). Others are the same as in Example 1.

Embodiment 3

[0036] This embodiment differs from the first and second embodiments in that the selected cyano resin is a phthalonitrile monomer. Others are identical with embodiment one and embodiment two.

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Abstract

The invention discloses a high-modulus and high-temperature-resistant bismaleimide resin composition. The bismaleimide resin composition is prepared from bismaleimide monomer, cyanide resin, aminostyrene, allyl compound, an oxime promoter and an imidazole promoter. A synergistic promotive special effect can be realized by adopting the oxime and imidazole dual-promoter system, the curing temperature is reduced to 200 DEG C, the glass transition temperature of the glass fiber composite material can achieve 370 DEG C without performing post-curing processing, and the use advantage of high-temperature using the aspects of composite material, the adhesive, the paint and the like by the bismaleimide at low-temperature curing is enlarged. Furthermore, the tensile modulus of a casting body thereofcan achieve 5.3GPa, the compression strength of the composite material is improved, and the new material is provided for torpedo, submarine oil pipeline and like applications needing the high modulusresin.

Description

technical field [0001] The invention belongs to the technical field of bismaleimide resins, and relates to a high-modulus and high-temperature resistant bismaleimide resin composition. Background technique [0002] The rapid development of aerospace vehicles urgently requires solutions with high temperature resistance, light weight, high strength and high rigidity, which provides a good opportunity for the development of high temperature resistant polymer matrix resins. Bismaleimide resin has excellent performance, and has both the ease of processing of epoxy resin and the high strength, high heat resistance, electrical insulation and weather resistance of polyimide resin. It has become a successor in the aerospace field. Another important matrix material in structural composites after epoxy resin. [0003] However, in order to give full play to the temperature resistance of the bismaleimide resin cured product and reach a glass transition temperature above 300°C, the post-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/12C08L79/08C08L79/04C08F283/00
CPCC08F283/00C08G73/12C08G73/126C08L79/085C08L2201/08C08L79/04
Inventor 岳伟单瑞俊袁远刘洪宇吕伟
Owner HENGSHEN