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A flexible electronic pressure sensing device and preparation method thereof

A sensing device and electronic technology, which is applied in the direction of fluid pressure measurement by changing the ohmic resistance, can solve the problems of high temperature resistance, immaturity, etc., and achieve the effect of long service life, high sensitivity, and thin size

Active Publication Date: 2021-02-26
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the current material preparation technology level of carbon nanotubes and graphene used in flexible sensors, the process is not yet mature, and there are also problems such as low temperature resistance, scope of application, and service life.

Method used

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  • A flexible electronic pressure sensing device and preparation method thereof
  • A flexible electronic pressure sensing device and preparation method thereof
  • A flexible electronic pressure sensing device and preparation method thereof

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Embodiment Construction

[0050] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0051] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element at the same time. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0052] It should also be noted that the orientation terms such as left, right, up, and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and should ...

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Abstract

The invention is applicable to the technical field of sensor manufacturing and packaging, and discloses a flexible electronic pressure sensing device and a preparation method thereof. The flexible electronic pressure sensing device includes a flexible shell, which has an internal cavity, the internal cavity includes a plurality of array channels and a communication cavity connected to the same end surface of the multiple array channels, and a liquid metal conductor is arranged in the internal cavity. The casing is connected with at least two electrodes connected to the liquid metal conductor. The preparation method of the flexible electronic pressure sensing device is used to prepare the above flexible electronic pressure sensing device. A flexible electronic pressure sensing device and its preparation method provided by the present invention, the flexible electronic pressure sensing device can completely fit the three-dimensional complex static / dynamic surface while completing the measurement of the contact pressure, and the stability, precision, accuracy And high reliability, high temperature resistance, wide application range, long service life.

Description

technical field [0001] The invention belongs to the technical field of manufacturing and packaging of electronic pressure sensors, and in particular relates to a flexible electronic pressure sensing device and a preparation method thereof. Background technique [0002] As people pay more and more attention to their own health, they are gradually keen on wearable devices that can collect real-time physiological parameters and analyze exercise status. As one of the core components of wearable devices, the sensor system has limited the further development of wearable devices due to its insufficient flexibility. In the application of real-time health detection, implanted medical devices, smart home and skin electronic devices, there is an urgent need for high-tech performance flexible electronics. Most of the current pressure sensors are still made of inorganic materials such as silicon. Once stretching or bending deformation occurs, the hardware structure of the sensor will b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/04
CPCG01L9/04
Inventor 李晖陈静高钦武王磊
Owner SHENZHEN INST OF ADVANCED TECH
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