Heat sink with jumping diaphragm

A technology of jumping diaphragms and heat sinks, which is applied in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc.

Active Publication Date: 2019-08-13
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies of the existing natural cooling power device heat dissipation method, and propose a kind of air pressure control water, lotus petal curved surface valve, gas expansion diaphragm jumping heat dissipation device

Method used

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  • Heat sink with jumping diaphragm
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  • Heat sink with jumping diaphragm

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Embodiment Construction

[0042] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0043] Such as figure 1 As shown, the heat dissipation device of the present invention is composed of a radiator 7, a device fixing platform 18, an air pressure water control unit 14 and a breathing unit. The air pressure water control unit 14 is installed on one side of the radiator 7, the device fixing platform 18 is located on the upper part of the radiator 7, and the breathing unit is embedded in the radiator 7. Power devices that need to be dissipated are fixed on the device fixing platform 18 .

[0044] The air pressure water control unit 14 is installed on one side of the radiator 7 , and is isolated from the radiator 7 by the heat insulating material installed between the air pressure water control unit 14 and the radiator 7 . The air pressure water control unit 14 is connected to the breathing unit through a water conduit, and provid...

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Abstract

A heat sink with a hopping diaphragm includes a radiator (7), a device mounting platform (18), an air pressure water control unit (14) and a breathing unit. The air pressure water control unit (14) isinstalled on one side of the radiator (7), the device mounting platform (18) is located on the upper part of the radiator (7), the breathing unit is embedded in the radiator (7), and a power device is fixed on the device mounting platform (18). The air pressure water control unit (14) is isolated from the radiator (7) by a heat insulation material and is connected to the breathing unit through awater conduit (12) to provide water for evaporative heat dissipation to the breathing unit. When a pressure greater than the hopping instability point pressure is applied to a truncated spherical hopping diaphragm (5) of the expansion unit of the breathing unit, the truncated spherical hopping diaphragm (5) is recessed downward, a petal curved-surface valve (6) closes, and gas in the expansion unit (4) is compressed; and the truncated spherical hopping diaphragm (5) is projected upward, the petal curved-surface valve (6) opens, air or water is sucked, and the gas in the expansion unit (4) is exhausted.

Description

technical field [0001] The invention relates to a heat dissipation device. Background technique [0002] The ubiquitous application of heat dissipation is recognized and accepted by people. Taking power electronic devices as an example, due to the self-loss of power devices, a lot of heat is generated, and the power loss is proportional to the power increase. At present, the heat dissipation methods mainly include: natural cooling, forced exhaust cooling, and water circulation cooling. Its cooling effect, cost, complexity, and energy loss are in order from low to high, and its reliability is in order from high to low, especially for wide-bandgap semiconductor devices with a junction temperature as high as 225°C. The temperature limit of water circulation cooling cannot exert wide-bandgap semiconductor devices. High temperature resistance characteristics of semiconductor devices. Therefore, heat dissipation is one of the key elements affecting the performance and quality o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/467H01L23/427
CPCH01L23/427H01L23/467
Inventor 王哲王一波曹国恩杨子龙
Owner INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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