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A Prediction Method of Assembly Accuracy

A technology of assembly accuracy and prediction method, which is applied in the fields of instrumentation, calculation, image data processing, etc., can solve the problems that the influence of surface topography and force deformation cannot be considered, and the accuracy of assembly accuracy prediction is difficult to guarantee.

Active Publication Date: 2020-08-18
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The embodiment of the present invention provides an assembly accuracy prediction method to solve the problem that the existing assembly accuracy prediction cannot take into account the influence of surface topography and force deformation, which makes it difficult to guarantee the accuracy of assembly accuracy prediction

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  • A Prediction Method of Assembly Accuracy
  • A Prediction Method of Assembly Accuracy
  • A Prediction Method of Assembly Accuracy

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Embodiment Construction

[0074] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0075] An embodiment of the present invention provides a method for predicting assembly accuracy, such as figure 1 shown, including:

[0076] Step 101, forming a target model according to assembly dimensions of at least two parts.

[0077] When predicting assembly accuracy, it is first necessary to construct a target model. When constructing the target model, it is necessary to obtain the assembly dimensions of at least two parts, and form the target model according to the assembly dimensions of at least two parts. It should be noted that since the assembly accuracy is predicted, the number of parts required is at least two. Of course, other numbers of parts can be used to construct the target model according to different assembly requirements.

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Abstract

The invention provides a method for predicting the assembly precision. The method comprises: target model is formed according to assembly sizes of at least two parts; on the basis of each group of fitting surfaces in the target model in corresponding assembling, geometric surfaces meeting a preset part design tolerance are generated respectively; multi-times simulation calculation is carried out on the generated geometric surfaces to obtain a relative position corresponding to each group of fitting surfaces in the target model; and according to the multi-times simulation calculation result, assembly precision values of at least two parts in assembling are obtained. According to the invention, with consideration of influences of the surface topography and force deformation during the assembly precision predicting process, the accuracy of the assembly precision prediction is improved; and a problem that the accuracy of the assembly precision prediction in the existing assembly precisionprediction plan can not be ensured is solved.

Description

technical field [0001] The invention relates to the technical field of mechanical engineering, in particular to a method for predicting assembly accuracy. Background technique [0002] Due to the existence of part processing errors, shape errors will inevitably appear on the part surface. At the same time, during the product assembly process, due to external forces such as positioning and clamping, the part surface will also be deformed to a certain extent. However, the existing assembly accuracy prediction methods all assume that the part is a rigid body, ignoring the influence of surface morphology and force deformation, resulting in the final prediction results inconsistent with the actual situation, and the accuracy is poor. Contents of the invention [0003] An embodiment of the present invention provides an assembly accuracy prediction method to solve the problem that the existing assembly accuracy prediction cannot take into account the influence of surface topograp...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T19/20G06T17/00
CPCG06T17/00G06T19/20
Inventor 刘检华丁晓宇张志强刘少丽熊辉邵楠
Owner BEIJING INSTITUTE OF TECHNOLOGYGY