A circuit board insulation processing equipment

A technology for processing equipment and circuit boards, which is applied in the secondary treatment of printed circuits, coating of non-metallic protective layers, etc.

Active Publication Date: 2019-09-24
JIANGXI LIANYI ELECTRONICS SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional circuit board contacts are exposed outside, which is easy to short circuit and burn the circuit, and even cause fire in serious cases, causing immeasurable damage to the environment

Method used

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  • A circuit board insulation processing equipment
  • A circuit board insulation processing equipment
  • A circuit board insulation processing equipment

Examples

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Embodiment Construction

[0021] The present invention is specifically described below in conjunction with accompanying drawing, as Figure 1-5 As shown, a circuit board insulation processing equipment includes a circuit board processing frame 1, which is characterized in that the circuit board processing frame 1 is located above the ground, and a circuit board lower surface filling mechanism is arranged above the circuit board processing frame 1, The circuit board lower surface filling mechanism consists of a circuit board lower surface filling block fixing frame 2 fixedly connected above the circuit board processing frame 1, and a circuit board lower surface filling block 3 arranged above the circuit board lower surface filling block fixing frame 2. , the circuit board lower surface filling hole 4 opened at the center of the circuit board lower surface filling block 3, the circuit board lower surface filling head 5 installed on the circuit board lower surface filling hole 4, opened on the circuit boar...

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Abstract

The invention discloses circuit board insulation processing equipment. The circuit board insulation processing equipment comprises a circuit board processing frame, wherein the circuit board processing frame is positioned above the ground; a circuit board lower surface filling mechanism is arranged above the circuit board processing frame; a circuit board upper surface filling mechanism is arranged above the circuit board lower surface filling mechanism; a controller, a battery box and a hot melt adhesive feeding mechanism are arranged on one side of the circuit board processing frame; the power supply input end of the controller is electrically connected with the battery box; the power supply output end of the controller is electrically connected with a linear motor, the hot melt adhesivefeeding mechanism, a thermistor II, a heating tube II, a thermistor I and a heating tube I; the signal input end of the controller is electrically connected with the thermistor I and the thermistor II; and the signal output end of the controller is electrically connected with the hot melt adhesive feeding mechanism, the linear motor, the heating tube I and the heating tube II separately. The circuit board insulation processing equipment has the beneficial effects of simple structure and high practicability.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to circuit board insulation processing equipment. Background technique [0002] Traditional circuit board contacts are exposed outside, which is easy to short circuit and burn the circuit, and even cause fire in serious cases, causing immeasurable damage to the environment. Contents of the invention [0003] The purpose of the present invention is to solve the above problems, and to design a circuit board insulation processing equipment. [0004] To achieve the above object, the technical solution of the present invention is a circuit board insulation processing equipment, including a circuit board processing frame, the circuit board processing frame is located above the ground, and a circuit board lower surface filling mechanism is arranged above the circuit board processing frame, The circuit board lower surface filling mechanism consists of a circuit board lower surface filling b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28
Inventor 王从宇陈静
Owner JIANGXI LIANYI ELECTRONICS SCI & TECH CO LTD
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