Method for processing excess tape of communication IC metal-based carrier board
A technology of metal base and carrier board, which is applied in the cleaning/polishing, photolithography/patterning, patterning and photolithography of conductive patterns, etc., to achieve the effect of reducing the scrap rate
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[0019] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0020] see figure 1 , the preferred embodiment of the present invention provides a kind of method for solving the residual glue of IC metal-based carrier board used for communication, comprising the following steps: then exposing the ink in the region that needs to be grooved on the first inner layer board, so that the ink occurs Optical reaction; then developing the ink in the unexposed area on the first inner layer plate to remove the ink through a chemical reaction, removing the ink in the unexposed area through a chemical reaction, and stacking PP on the developed area, Make the PP powder produced during the pressing process fall on the ink; then place a gasket in the area where the PP is not stacked, and play a supporting role in the second inner layer board pressing process; then place the PP and the gasket Place the second inner layer board on ...
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