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Electronic device with soundproof structure

A technology of electronic equipment and components, applied in the field of sound insulation structure, can solve problems affecting the performance of components and modules, and degradation of component performance

Active Publication Date: 2018-06-29
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High temperature heat generated from components may cause degradation of component performance, or affect the performance of other components and modules

Method used

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  • Electronic device with soundproof structure
  • Electronic device with soundproof structure
  • Electronic device with soundproof structure

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Embodiment Construction

[0022] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to aid in that understanding, but these are to be regarded as exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. Also, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

[0023] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Accordingly, it should be apparent to those skilled in the art that the following desc...

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Abstract

An electronic device having a soundproof structure is provided. The electronic device includes a housing including an internal space, an inlet and an outlet formed on one side of the housing, a cooling fan disposed in the internal space, and configured to create an air-flow introduced from the inlet which is discharged to the outlet, and a sound absorbing member disposed to surround, at least in part, a peripheral area of the cooling fan in a direction to not obstruct the air-flow.

Description

technical field [0001] The present disclosure relates to a soundproof structure for reducing noise generated inside electronic equipment. Background technique [0002] Electronic devices such as mobile phones, tablet computers, and notebooks are widely used, and users can access various contents through the electronic devices while carrying the electronic devices. The electronic device may employ various components and modules such as a module for transmitting and receiving data, a battery, a driver chip, and the like, and a circuit board on which internal components are mounted to enable access to various contents. [0003] Some components of the above internal modules may emit high temperature heat depending on performance. The high temperature heat generated from the components may cause the performance of the components to deteriorate, or affect the performance of other components and modules. Therefore, heat dissipation products having various shapes or structures are...

Claims

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Application Information

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IPC IPC(8): G06F1/16G06F1/20
CPCG06F1/1656G06F1/203G06F1/1616H01L23/467H01L23/427H05K5/06G10K11/16G10K2210/11
Inventor 丁麒声徐成教林京日郑熙
Owner SAMSUNG ELECTRONICS CO LTD