Novel server heat dissipation device

Abstract

The invention discloses a novel server heat dissipation device and belongs to the technical field of computer servers. The novel server heat dissipation device is used for solving the problems that heat dissipation of the conventional large computer server is realized by a fan carried by the server or the server is placed in a constant temperature room, the heat dissipation effect of the previousis poor and the latter is high in cost for maintaining the constant temperature in the room. The novel server heat dissipation device comprises a box body, a first heat dissipation assembly and a second heat dissipation assembly, wherein the first heat dissipation assembly comprises a breather pipe and an exhaust fan; the breather pipe is arranged on the top of the box body; the exhaust fan is arranged at the bottom of the box body; the second heat dissipation assembly comprises a radiator and heat-conducting fins; the radiator is arranged on the top wall of the box body; one ends of the heat-conducting fins are arranged on the radiator; the other ends of the heat-conducting fins penetrate through a box cover to be arranged outside the box cover; a bracket used for placing the server is arranged inside the box body and comprises a plurality of transverse plates; the two ends of the transverse plates respectively run through and extend out of the side walls of the box body; and a cooling water tank is arranged on a part, which extends out of the side wall of the box body, of the transverse plates.

Description

technical field [0001] The invention relates to the technical field of computer servers, in particular to a novel server cooling device. Background technique [0002] With the development of information technology, cloud computing and big data are gradually entering people's lives. With the improvement of computer computing and processing capabilities, the heat generated by chips is also increasing at an alarming rate. The server chassis is similar to the general computer chassis, including processor, hard disk, memory, system bus, etc. Due to the continuous development of electronic technology at this stage, with the continuous improvement of system and device power consumption, the heat generated by the internal components of the server continues to increase. , heat dissipation has become the biggest problem facing server development. Most of the heat dissipation of existing large-scale computer servers is through the fan that comes with the server, or placed in a room wi...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that most of the heat dissipation of existing large-scale computer servers is through the fan that comes with the server, or placed in a room with a constant temperature, the former leads to poor heat dissipation, and the latter leads to the problem of high cost of maintaining a constant temperature in the room. The invention provides a new type of server cooling device

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