Substrate processing equipment

Abstract

The substrate processing device includes a base, a substrate carrier, a plurality of lifting main collecting parts, a first power part and a lifting control part. The substrate carrier is rotatably connected to the base for fixing and rotating the substrate. A plurality of lift-type main collectors are arranged on the periphery of the substrate platform for collecting the processing liquid for processing the substrate. Each elevating main collecting part includes an elevating shaft and a processing liquid collecting ring. The lift shaft includes a lift wheel assembly. The lifting wheel assembly is used to drive the lifting shaft to go up and down. The processing liquid collection ring is connected to the lifting shaft. The first power part is arranged on the base, and is used for providing power to the lifting type main collecting part, so as to make the lifting type main collecting part go up and down. The lift control part is connected to the first power part to control the first power part to transmit power to the lift wheel assembly corresponding to the lift shaft of the lift-type main collecting part.

Description

technical field [0001] The present invention relates to a substrate processing device, in particular to a substrate processing device that can provide power to raise and lower a plurality of collecting parts by means of a power part, and can achieve the effect of simplifying the operation of the device. Background technique [0002] In the semiconductor process, a wafer processing device is often used to etch or clean the wafer. like figure 1 As shown, the wafer processing apparatus 800 has a rotating platform 810, a liquid application member 820, a plurality of liquid recovery rings 830, 831, 832, a plurality of first power lifts 850, 851, 852 and a plurality of second power lifts Parts 860, 861, 862, each liquid recovery ring corresponds to a first power lifting part and a second power lifting part. The rotating platform 810 is used to fix the wafer W and allow the wafer W to rotate. The liquid applicator 820 is used for applying etching liquid or cleaning liquid to the...

AI Technical Summary

Problems solved by technology

However, in this configuration, one recovery ring needs to be equipped with a power lifter, and multiple recovery rings need to be matched with multiple power lifters. This configuration still has the problem of complicated control and damage of each power lifter

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