Preparation method of printed circuit board
A technology for printed circuit boards and circuit boards, which is used in the manufacture of printed circuits, the formation of printed circuits, and the formation of electrical connection of printed components, which can solve the problems of difficulty in metallization of the connection between through grooves and blind grooves.
Active Publication Date: 2018-06-29
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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[0004] Based on this, the present invention overcomes the defects of the prior art and provides a method for preparing a printed circuit board to solve the problem that it is difficult to achieve metallization at the connection between the through groove and the blind groove
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[0020] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or a central element may also exist. When an element is considered to be "connected" to another element, it can be directly connected to the other element or an intermediate element may be present at the same time. In contrast, when an element is referred to as being "directly on" another element, there are no intervening ele...
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Abstract
The invention relates to a preparation method of a printed circuit board. The preparation method comprises the following steps: (S100) presetting a first metal block and a second metal block in a circuit board body at an interval, wherein a connecting region is formed on the circuit board body between the first metal block and the second metal block; (S200) forming a through slot in the connectingregion on the circuit board body, wherein the first metal block and the second metal block are located on the slot wall of the through slot; (S300) metalizing the slot wall of the through slot so asto cover the slot wall of the through slot with a metal layer; (S400) forming a blind slot in the other side of the connecting region on the circuit board body, wherein the blind slot corresponds to the connecting region; and (S500) removing the connecting region so as to form a connecting hole for communicating the blind slot with the through slot. According to the preparation method, the problemthat the joint between the through slot and the blind slot is difficult to be metalized is solved.
Description
Technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for preparing printed circuit boards. Background technique [0002] With the rapid development of electronic products in the direction of miniaturization, high density, high integration and multi-function, the signal output requirements of the products are getting higher and higher. [0003] In some circuit boards, connected through grooves and blind grooves are designed, pads are preset in the blind grooves, and a metal layer is metalized on the groove walls of the through grooves. However, since the blind groove and the through groove are connected, it is difficult to metallize the connection between the through groove and the blind groove. Summary of the invention [0004] Based on this, the present invention overcomes the defects of the prior art and provides a method for preparing a printed circuit board to solve the problem of difficulty in metallization at the con...
Claims
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IPC IPC(8): H05K3/40
CPCH05K3/40H05K2203/0723
Inventor 李冲林楚涛李艳国
Owner GUANGZHOU FASTPRINT CIRCUIT TECH